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Mikael, Lindeberg
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Publications (10 of 24) Show all publications
Lindeberg, M. & Hjort, K. (2009). High aspect ratio “multiple wire” microvias in flexible PCBs. Circuit world, 35(4), 18-21
Open this publication in new window or tab >>High aspect ratio “multiple wire” microvias in flexible PCBs
2009 (English)In: Circuit world, ISSN 0305-6120, E-ISSN 1758-602X, Vol. 35, no 4, p. 18-21Article in journal (Refereed) Published
National Category
Engineering and Technology
Identifiers
urn:nbn:se:uu:diva-111688 (URN)10.1108/03056120911002370 (DOI)000273205400002 ()
Projects
wisenet
Available from: 2009-12-21 Created: 2009-12-21 Last updated: 2017-12-12
Lindeberg, M. & Hjort, K. (2009). Multiple nanowire via interconnects in flexible printed circuit boards. In: Smart Systems Integration 2009: . Paper presented at Smart Systems Integration (pp. 6-11).
Open this publication in new window or tab >>Multiple nanowire via interconnects in flexible printed circuit boards
2009 (English)In: Smart Systems Integration 2009, 2009, p. 6-11Conference paper, Published paper (Other academic)
National Category
Engineering and Technology
Identifiers
urn:nbn:se:uu:diva-111696 (URN)
Conference
Smart Systems Integration
Projects
wisenet
Available from: 2009-12-21 Created: 2009-12-21 Last updated: 2016-04-14Bibliographically approved
Lindeberg, M., Yousef, H., Rödjegård, H., Martin, H. & Hjort, K. (2008). A PCB-like Process for Vertically Configured Thermopiles. Journal of Micromechanics and Microengineering, 18(6), 065021
Open this publication in new window or tab >>A PCB-like Process for Vertically Configured Thermopiles
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2008 (English)In: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 18, no 6, p. 065021-Article in journal (Refereed) Published
Abstract [en]

Thermopiles are important components in infrared thermal detectors, thermoelectric generators and thermoelectric coolers. We present a thermopile structure with up to 224 vertically arranged thermocouple legs in a polyimide flex material. The thermopile is optimized for infrared thermal radiation detection and is fabricated using printed circuit board-like (PCB-like) processing. Each thermoelectric leg consists of a bundle of a few hundred sub-micrometre-sized strands of either antimony or nickel. These metal wire bundles were achieved by employing ion track technology on the polyimide foil, resulting in a porous dielectric material. Electrochemical methods were used to grow the thermoelectric materials in the pores. The plating mask was produced in a laminated dry photoresist. A small metal cross section, 20 mu m(2) (1 vol%), ensured a low heat exchange between the two surfaces of the flex. The typical resistance per thermocouple was 34 Omega. A responsivity to irradiance of 4.3 V mm(2) W(-1) was measured when heating with a white light source (irradiance 1 mW mm(-2)).

National Category
Engineering and Technology
Identifiers
urn:nbn:se:uu:diva-96878 (URN)10.1088/0960-1317/18/6/065021 (DOI)000256619600039 ()
Projects
wisenet
Available from: 2008-03-19 Created: 2008-03-19 Last updated: 2017-12-14Bibliographically approved
Yousef, H., Lindeberg, M. & Hjort, K. (2008). Ion Track Enabled Multiple Wire Microvia Interconnects in Printed Circuit Boards. Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, 266(8), 1659-1665
Open this publication in new window or tab >>Ion Track Enabled Multiple Wire Microvia Interconnects in Printed Circuit Boards
2008 (English)In: Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, ISSN 0168-583X, E-ISSN 1872-9584, Vol. 266, no 8, p. 1659-1665Article in journal (Refereed) Published
Abstract [en]

As the call for higher wiring density in packaging and vertical microvia interconnections (microvias) rapidly evolves, the need for smaller lateral dimensions in printed circuit boards (PCB) microvias must be met. The ion track lithography described in this paper allows for high throughput micromachining of small, deep, vertical microvias in flexible PCB and all-polymer laminates.

Ion track lithography makes use of swift heavy ion irradiation to enhance the selectivity and directionality of chemical etching. Within the areas exposed to the ion irradiation, small sub-micron pores (capillaries) are created, one for every ion. If etching is prolonged, the pores become merged. Electrodeposition from a metallic seed layer is used to fill these structures with metal. The lithography masks define either the areas where the ion tracks are developed or where the tracks are metallized. The smallest achievable size of the microvias is only limited by the resolution of the mask; microvias below 10 μm in diameter can also be achieved also in thick polyimide foils.

Since each impinging ion forms one track, the foil’s porosity can be controlled by adjusting the irradiation dose, as well as by etching the pores to a suitable size. Depending on the porosity and material, the resultant metallized microvia consists of either individual or interlaced wires (like strands in a bundle wire), or is a solid. As an individual sub-micron wire may have an aspect ratio of several hundreds, this allows for the fabrication of truly vertical microvia structures, allowing ultra-high density microvia batch production.

Demonstrator microstructures with highly vertical microvias have been fabricated in foils up to 125 μm thickness. Several components integrated in flexible PCB have been presented by us, e.g. magnetoresistive sensors, thermopile IR-sensors and microwave components like inductor elements.

Keywords
Printed circuit board, Polyimide, Foil, Lithography, Ion track, Template
National Category
Engineering and Technology
Identifiers
urn:nbn:se:uu:diva-96876 (URN)10.1016/j.nimb.2007.11.014 (DOI)000256677600105 ()
Projects
wisenet
Available from: 2008-03-19 Created: 2008-03-19 Last updated: 2017-12-14Bibliographically approved
Hjort, K., Yousef, H. & Lindeberg, M. (2008). Ion track lithography for flexible PCB manufacturing. In: International Confonference on Atomic Collisions in Solids – ICACS23: . Paper presented at Int. Conf. on Atomic Collisions in Solids (pp. 61-66).
Open this publication in new window or tab >>Ion track lithography for flexible PCB manufacturing
2008 (English)In: International Confonference on Atomic Collisions in Solids – ICACS23, 2008, p. 61-66Conference paper, Published paper (Refereed)
National Category
Engineering and Technology
Identifiers
urn:nbn:se:uu:diva-111693 (URN)
Conference
Int. Conf. on Atomic Collisions in Solids
Available from: 2009-12-21 Created: 2009-12-21 Last updated: 2016-04-13Bibliographically approved
Yousef, H., Lindeberg, M. & Hjort, K. (2008). Ion track technology for electronics manufacturing. In: 7th Int. Symp. on Swift Heavy Ions in Matter: SHIM (June 2-5, 2008, Lyon, France) (pp. 29).
Open this publication in new window or tab >>Ion track technology for electronics manufacturing
2008 (English)In: 7th Int. Symp. on Swift Heavy Ions in Matter: SHIM (June 2-5, 2008, Lyon, France), 2008, p. 29-Conference paper, Published paper (Refereed)
Identifiers
urn:nbn:se:uu:diva-17680 (URN)
Projects
Wisenet
Available from: 2008-08-14 Created: 2008-08-14 Last updated: 2011-01-12
Yousef, H., Hjort, K. & Lindeberg, M. (2008). Plated Through-Hole Vias in a Porous Polyimide Foil for Flexible Printed Circuit Boards. Journal of Micromechanics and Microengineering, 18(1), 017001
Open this publication in new window or tab >>Plated Through-Hole Vias in a Porous Polyimide Foil for Flexible Printed Circuit Boards
2008 (English)In: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 18, no 1, p. 017001-Article in journal (Refereed) Published
Abstract [en]

A fabrication process for high aspect ratio plated through-hole vias is presented for flexibleprinted circuit boards. A 75 μm thick porous Kapton foil that allows direct definition of highaspect ratio through-hole vias by dry photoresist film lithography and electrodeposition ispresented. Pretreatment with swift heavy ion irradiation and wet etching define the poredensity and porosity of the foil, similar to ion-track-etched filter membranes. Thin filmmetallization of a seed layer and lithography of a laminated dry photoresist film define the viasizes and positions. Subsequent through-hole electrodeposition produces vias consisting ofmultiple wires, where each open pore defines one wire. The via geometries are characterizedby scanning electron microscopy. The electrical properties of the vias are characterized byresistance measurements. Vias with an aspect ratio over 2 and a side length of 33 μm showhigh yield with low resistance and low variation in resistance.

National Category
Materials Engineering
Identifiers
urn:nbn:se:uu:diva-96875 (URN)10.1088/0960-1317/18/1/017001 (DOI)000252965900030 ()
Projects
wisenet
Available from: 2008-03-19 Created: 2008-03-19 Last updated: 2017-12-14Bibliographically approved
Lindeberg, M., Yousef, H., Röjdegård, H., Martin, H. & Hjort, K. (2007). Flexible PCB Vertical Thermopile IR Sensor Proc. Solid-State Sensors, Actuators and Microsystems Conference. In: : . Paper presented at TRANSDUCERS 2007, Lyon, France June 10-14 (pp. 2275-2278).
Open this publication in new window or tab >>Flexible PCB Vertical Thermopile IR Sensor Proc. Solid-State Sensors, Actuators and Microsystems Conference
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2007 (English)Conference paper, Published paper (Refereed)
National Category
Engineering and Technology
Identifiers
urn:nbn:se:uu:diva-13055 (URN)
Conference
TRANSDUCERS 2007, Lyon, France June 10-14
Available from: 2008-01-22 Created: 2008-01-22 Last updated: 2016-04-08
Yousef, H., Lindeberg, M. & Hjort, K. (2007). Ion track enabled multiple wire via interconnects in printed circuit boards. In: 18th Int Conf on Ion Beam Analysis: IBA18, (Hyderabd, India, 23-28 September, 2007).
Open this publication in new window or tab >>Ion track enabled multiple wire via interconnects in printed circuit boards
2007 (English)In: 18th Int Conf on Ion Beam Analysis: IBA18, (Hyderabd, India, 23-28 September, 2007), 2007Conference paper, Published paper (Other (popular science, discussion, etc.))
Identifiers
urn:nbn:se:uu:diva-17679 (URN)
Projects
Wisenet
Available from: 2008-08-14 Created: 2008-08-14 Last updated: 2011-01-18
Yousef, H., Hjort, K. & Lindeberg, M. (2007). Reliable small via interconnects made of multiple sub-micron wires in flexible PCB boards. Journal of Micromechanics and Microengineering, 17(4), 700-708
Open this publication in new window or tab >>Reliable small via interconnects made of multiple sub-micron wires in flexible PCB boards
2007 (English)In: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 17, no 4, p. 700-708Article in journal (Refereed) Published
Abstract [en]

A fabrication process for small through-hole vias consisting of multiple sub-micron electrodeposited wires has been developed for flexible printed circuit boards (PCB). The resistance of the vias is controlled by adjusting the number of wires per via, as well as the dimensions of the wires. The process steps include modification of the foils by irradiation with energetic ions, wet etching and metallization of the through-hole vias, double-sided surface metallization of the dielectric layer and interconnection lithography. Series of up to 360 interconnected vias of electrodeposited nickel are demonstrated in a flexible PCB foil (75 µm Kapton HN polyimide). The vias have a lateral size of 26 µm. The metal content of the demonstrated vias is 0.12% and 10% of their total volume, corresponding to a metal cross-section of 3.2 µm2 and 270 µm2, respectively. The electrical resistance per interconnected via is 2.6 Ω and 0.07 Ω, respectively. The vias can carry a current density of at least 4 × 106 A cm−2.

National Category
Engineering and Technology
Identifiers
urn:nbn:se:uu:diva-96874 (URN)10.1088/0960-1317/17/4/005 (DOI)000245434200011 ()
Available from: 2008-03-19 Created: 2008-03-19 Last updated: 2017-12-14Bibliographically approved
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