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Substrate Integrated Waveguides (SIW) in a Flexible Printed Circuit Board for Millimeter Wave Applications
Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrosystemteknik.
Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrovågs- och terahertzteknik. (Mikrovågsteknik)
Uppsala universitet, Teknisk-naturvetenskapliga vetenskapsområdet, Tekniska sektionen, Institutionen för teknikvetenskaper, Mikrosystemteknik. (materialvetenskap)
2009 (engelsk)Inngår i: Journal of microelectromechanical systems, ISSN 1057-7157, E-ISSN 1941-0158, Vol. 18, nr 1, s. 154-162Artikkel i tidsskrift (Fagfellevurdert) Published
Abstract [en]

Substrate integrated waveguides (SIWs) are presented and demonstrated in a flexible printed circuit board (flex PCB) for application in the 77-81 GHz range. The vertical walls of the SIWs presented in this paper consist of multiple electrodeposited metallic wires. The diameters of these wires and the spacing between them are on the order of hundreds of nanometers. Hence, the walls can be seen as continuous metallic walls, and the leakage losses through them become negligible. In turn, the SIWs presented in this paper can operate at higher frequencies compared with previously presented structures that are realized with PCB fabrication processes. The attenuation of the SIWs is comparable to that of microstrip lines on the same sample. The SIWs are successfully demonstrated in a SIW-based slot antenna. The antenna gain along the z-axis (normal-to-plane) was found to be around 2.8 dBi at 78 GHz which is in agreement with the simulated values. [2008-0047]

sted, utgiver, år, opplag, sider
2009. Vol. 18, nr 1, s. 154-162
Emneord [en]
Flexible printed circuit boards (flex PCB), millimeter-wave (mm-W) antennas, millimeter waves, polyimide foils, substrate integrated waveguides (SIWs)
HSV kategori
Forskningsprogram
Teknisk fysik med inriktning mot mikrovågsteknik
Identifikatorer
URN: urn:nbn:se:uu:diva-96879DOI: 10.1109/JMEMS.2008.2009799ISI: 000263123100016OAI: oai:DiVA.org:uu-96879DiVA, id: diva2:171607
Tilgjengelig fra: 2008-03-19 Laget: 2008-03-19 Sist oppdatert: 2017-12-14bibliografisk kontrollert
Inngår i avhandling
1. High Aspect Ratio Microstructures in Flexible Printed Circuit Boards: Process and Applications
Åpne denne publikasjonen i ny fane eller vindu >>High Aspect Ratio Microstructures in Flexible Printed Circuit Boards: Process and Applications
2008 (engelsk)Doktoravhandling, med artikler (Annet vitenskapelig)
Abstract [en]

Flexible printed circuit boards (flex PCBs) are used in a wide range of electronic devices today due to their light weight, bendability, extensive wiring possibilities, and low-cost manufacturing techniques. The general trend in the flex PCB industry is further miniaturization alongside increasing functionality per device and reduced costs. To meet these demands, a new generation of low cost manufacturing technologies is being developed to enable structures with smaller lateral dimensions and higher packing densities.

Wet etching is today the most cost-efficient method for producing a large number of through-foil structures in flex PCBs. However, conventional wet etch techniques do not allow for through-foil structures with aspect ratios over 1 – a fact that either necessitates thin and mechanically weak foils or puts severe limitations on the packing density. The fabrication techniques presented in this thesis allow for through-foil structures with higher aspect ratios and packing densities using wet etching. To achieve high aspect ratios with wet etching, the flex PCB foils are pre-treated with irradiation by swift heavy ions. Each ion that passes through the foil leaves a track of damaged material which can be subsequently etched to form highly vertical pores. By using conventional flex PCB process techniques on the porous foils, high aspect ratio metallized through-foil structures are demonstrated.

The resulting structures consist of multiple sub-micrometer sized wires. These structures are superior to their conventional counterparts when it comes to their higher aspect ratios, higher possible packing densities and low metallic cross-section. Furthermore, metallized through-foil structures with larger areas and more complicated geometries are possible without losing the mechanical stability of the foil. This in turn enables applications that are not possible using conventional techniques and structures. In this thesis, two such applications are demonstrated: flex PCB vertical thermopile sensors and substrate integrated waveguides for use in millimeter wave applications.

sted, utgiver, år, opplag, sider
Uppsala: Acta Universitatis Upsaliensis, 2008. s. 58
Serie
Digital Comprehensive Summaries of Uppsala Dissertations from the Faculty of Science and Technology, ISSN 1651-6214 ; 407
Emneord
Engineering physics, flexible printed circuit boards, polyimide, through-hole vias, ion track technology, thermoelectricity, thermopiles, substrate integrated waveguides, millimeter wave devices, Teknisk fysik
HSV kategori
Identifikatorer
urn:nbn:se:uu:diva-8565 (URN)978-91-554-7127-9 (ISBN)
Disputas
2008-04-11, SiegbahnSalen, Ångströmlaboratoriet, Lägerhyddsvägen 1, Uppsala, 09:30
Opponent
Veileder
Prosjekter
wisenet
Tilgjengelig fra: 2008-03-19 Laget: 2008-03-19 Sist oppdatert: 2011-01-17bibliografisk kontrollert
2. Integrated Antenna Solutions for Wireless Sensor and Millimeter-Wave Systems
Åpne denne publikasjonen i ny fane eller vindu >>Integrated Antenna Solutions for Wireless Sensor and Millimeter-Wave Systems
2009 (engelsk)Doktoravhandling, med artikler (Annet vitenskapelig)
Abstract [en]

This thesis presents various integrated antenna solutions for different types of systems and applications, e.g. wireless sensors, broadband handsets, advanced base stations, MEMS-based reconfigurable front-ends, automotive anti-collision radars, and large area electronics.

For wireless sensor applications, a T-matched dipole is proposed and integrated in an electrically small body-worn sensor node. Measurement techniques are developed to characterize the port impedance and radiation properties. Possibilities and limitations of the planar inverted cone antenna (PICA) for small handsets are studied experimentally. Printed slot-type and folded PICAs are demonstrated for UWB handheld terminals.

Both monolithic and hybrid integration are applied for electrically steerable array antennas. Compact phase shifters within a traveling wave array antenna architecture, on single layer substrate, is investigated for the first time. Radio frequency MEMS switches are utilized to improve the performance of reconfigurable antennas at higher frequencies. Using monolithic integration, a 20 GHz switched beam antenna based on MEMS switches is implemented and evaluated. Compared to similar work published previously, complete experimental results are here for the first time reported. Moreover, a hybrid approach is used for a 24 GHz switched beam traveling wave array antenna. A MEMS router is fabricated on silicon substrate for switching two array antennas on a LTCC chip.

A concept of nano-wire based substrate integrated waveguides (SIW) is proposed for millimeter-wave applications. Antenna prototypes based on this concept are successfully demonstrated for automotive radar applications.

W-band body-worn nonlinear harmonic radar reflectors are proposed as a means to improve automotive radar functionality. Passive, semi-passive and active nonlinear reflectors consisting of array antennas and nonlinear circuitry on flex foils are investigated.

A new stretchable RF electronics concept for large area electronics is demonstrated. It incorporates liquid metal into microstructured elastic channels. The prototypes exhibit high stretchability, foldability, and twistability, with maintained electrical properties.

sted, utgiver, år, opplag, sider
Uppsala: Acta Universitatis Upsaliensis, 2009. s. 114
Serie
Digital Comprehensive Summaries of Uppsala Dissertations from the Faculty of Science and Technology, ISSN 1651-6214 ; 698
Emneord
harmonic radar (HR), liquid alloy, millimeter-wave, micromachining, phase shifters, planar inverted cone antennas (PICA), printed circuit boards (PCB), quasi-Yagi antennas, radio frequency microelectromechanical system (RF MEMS), stretchable antennas, substrate integrate waveguides (SIW), T-matched dipole antennas, tapered slot antennas, traveling wave array antennas, ultrawideband (UWB), wireless sensor networks.
HSV kategori
Forskningsprogram
Elektronik
Identifikatorer
urn:nbn:se:uu:diva-111197 (URN)978-91-554-7681-6 (ISBN)
Disputas
2010-01-29, Siegbhansalen, Lägerhyddsvägen 1, The Ångström Laboratory, Uppsala, 13:30 (engelsk)
Opponent
Veileder
Prosjekter
wisenet
Tilgjengelig fra: 2010-01-07 Laget: 2009-12-06 Sist oppdatert: 2018-06-07bibliografisk kontrollert

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