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Flowing and pressurizing a solid-liquid two phase monodispersed fluid with high solid content in a transparent microfluidic high-pressure chip
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology.ORCID iD: 0000-0002-3966-0220
Mycronic AB, Täby.; Chalmers Univ Technol, MC2, EMSL, Gothenburg.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology.
2017 (English)In: 28TH MICROMECHANICS AND MICROSYSTEMS EUROPE WORKSHOP, IOP PUBLISHING LTD , 2017, article id UNSP 012010Conference paper, Published paper (Refereed)
Abstract [en]

Handling highly concentrated solid-liquid two-phase fluids in microfluidics is challenging. In this paper, we present the first studies of flowing solder paste with a high solid content in a transparent high-pressure tolerant glass chip, thereby increasing the understanding of how multiphase liquids with high density difference between the phases behave in small channels (840 mu m in diameter). The system, including a custom made high-pressure, low resistance, interface, was continuously operated at pressures up to of 6 MPa and devices where shown to have pressure tolerance up to 17 MPa. During flow through the chip, the packing density of the solder balls displayed inhomogeneity over the channel where chains of solder balls in contact with each other were formed together with voids. These in-homogeneities persisted along the channel during flow. The flow rate of the paste through the chip oscillated between 63 to 350 mu m/s when pumping at constant volume rate of 30 mu l/min. When a pressure of 2 MPa was applied, the volume of the solder paste particle segment decreased 1.6%, and 0.1% was elastically recovered when the pressure was released. It is concluded that this transparent microfluidic high-pressure glass chip with the special developed interface is suitable for flow studies of solder paste with a high solid content.

Place, publisher, year, edition, pages
IOP PUBLISHING LTD , 2017. article id UNSP 012010
Series
Journal of Physics Conference Series, ISSN 1742-6588 ; 922
National Category
Energy Engineering Mechanical Engineering Physical Sciences
Identifiers
URN: urn:nbn:se:uu:diva-347121DOI: 10.1088/1742-6596/922/1/012010ISI: 000419231200010OAI: oai:DiVA.org:uu-347121DiVA, id: diva2:1193384
Conference
28th Micromechanics and Microsystems Europe Workshop (MME), AUG 23-25, 2017, Uppsala, SWEDEN
Funder
Knut and Alice Wallenberg FoundationAvailable from: 2018-03-26 Created: 2018-03-26 Last updated: 2018-03-26Bibliographically approved

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Andersson, MartinKlintberg, Lena

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