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A solder sealing method for paraffin-filled microcavities
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Materials Science. (ÅSTC)
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Materials Science. (ÅSTC)
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Materials Science. (ÅSTC)
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Materials Science. (ÅSTC)
2006 (English)In: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 16, no 11, p. 2369-2374Article in journal (Refereed) Published
Abstract [en]

Demonstrated and investigated here is a method to seal microfluidic systems by soldering. As a particularly difficult case of growing importance, the sealing of openings contaminated with paraffin wax was studied. Solder paste, screen printed on a metallized silicon, substrate was melted locally through application of 6.5 to 10 V to a 5 Ω copper film resistor for a few seconds and found able to drive an intermediate layer of paraffin away and seal a 0.2 mm diameter circular via by wetting to a surrounding copper pad. Although verified to be robust, the process did result in failing seals on excessive heating because of consumption of the pads. Correctly performed, the technique provided a seal at least withstanding a pressure of 8 bar for 8 h at 85ºC.

Place, publisher, year, edition, pages
2006. Vol. 16, no 11, p. 2369-2374
Keywords [en]
seal, sealing, solder, soldering, micro-, fluidic, paraffin
National Category
Other Materials Engineering
Research subject
Engineering Science with specialization in Microsystems Technology
Identifiers
URN: urn:nbn:se:uu:diva-94873DOI: 10.1088/0960-1317/16/11/017ISI: 000242169500017OAI: oai:DiVA.org:uu-94873DiVA, id: diva2:168878
Available from: 2006-09-15 Created: 2006-09-15 Last updated: 2017-12-14Bibliographically approved
In thesis
1. Fluidic Microsystems for Micropropulsion Applications in Space
Open this publication in new window or tab >>Fluidic Microsystems for Micropropulsion Applications in Space
2006 (English)Doctoral thesis, comprehensive summary (Other academic)
Abstract [en]

Spacecraft on interplanetary missions or advanced satellites orbiting the Earth all require propulsion systems to complete their missions. Introducing microelectromechanical systems technology to the space industry will not only reduce size and weight of the propulsion system, but can also increase the performance of the mission.

Fluid handling systems are used in chemical and electric propulsion. Some components incorporated in a fluidic handling system are presented and evaluated in this work.

Microsystems are very sensitive to contamination. Reliable, robust, and easily integrated filters were modeled, manufactured, and experimentally verified.

A fluid connector, designed to withstand large temperature variations and aggressive propellants was manufactured and characterized. Similar designs was also be used as a thermally activated minute valve.

The feasibility of a cold gas system for precise attitude control has been demonstrated. Steps towards improving the performance (from specific im-pulse 45 s) have been taken, by the integration of suspended heater elements.

For electric propulsion, two thermally regulated flow restrictors have been characterized. These devices can fine-tune the propellant flow to e.g. an ion engine.

A single-use valve using a soldered seal has also been successfully dem-onstrated within a pressure range of 5 to 100 bar.

The microsystem-based propulsion systems of tomorrow’s spacecraft need to be demonstrated in space, in order to gain necessary credibility.

Place, publisher, year, edition, pages
Uppsala: Acta Universitatis Upsaliensis, 2006. p. 34
Series
Digital Comprehensive Summaries of Uppsala Dissertations from the Faculty of Science and Technology, ISSN 1651-6214 ; 223
Keywords
Engineering physics, microelectromechanical systems, MEMS, MST, microsystem, microfluidics, silicon, spacecraft, propulsion, space technology, Teknisk fysik
Identifiers
urn:nbn:se:uu:diva-7148 (URN)91-554-6655-9 (ISBN)
Public defence
2006-10-06, Polhelmssalen, Ångströmslaboratoriet, Lägerhyddsvägen 1, Uppsala, 09:15
Opponent
Supervisors
Available from: 2006-09-15 Created: 2006-09-15 Last updated: 2013-09-26Bibliographically approved
2. Microsystem Interfaces for Space
Open this publication in new window or tab >>Microsystem Interfaces for Space
2006 (English)Doctoral thesis, comprehensive summary (Other academic)
Abstract [en]

Microsystem interfaces to the macroscopic surroundings and within the microsystems themselves are formidable challenges that this thesis makes an effort to overcome, specifically for enabling a spacecraft based entirely on microsystems. The NanoSpace-1 nanospacecraft is a full-fledged satellite design with mass below 10 kg. The high performance with respect to mass is enabled by a massive implementation of microsystem technology – the entire spacecraft structure is built from square silicon panels that allow for efficient microsystem integration. The panels comprise bonded silicon wafers, fitted with silicone rubber gaskets into aluminium frames. Each module of the spacecraft is added in a way that strengthens and stiffens the overall spacecraft structure.

The structural integrity of the silicon module as a generic building block has been successfully proven. The basic design (silicon, silicone, aluminium) survived considerable mechanical loads, where the silicon material contributed significantly to the strength of the structural element. Structural modeling of the silicon building blocks enables rapid iterative design of e.g. spacecraft structures by the use of pertinent model simplifications.

Other microsystem interfaces treats fluidic, thermal, and mechanical functions. First, solder sealing of microsystem cavities was demonstrated, using screen-printed solder and localized resistive heating in the microsystem interface. Second, a dismountable fluidic microsystem connector, using a ridged silicon membrane, intended for monopropellant thruster systems, was developed. Third, a thermally regulated microvalve for minute flows, made by a silicon ridge imprint in a stainless steel nipple, was investigated. Finally, particle filters for gas interfaces to microsystems, or between parts of fluidic microsystems, were made from sets of crossed v-grooves in the interface of a bonded silicon wafer stack. Filter manufacture, mass flow and pressure drop characterization, together with numeric modeling for filter design, was performed.

All in all this reduces the weight and volume when microsystems are interfaced in their applications.

Place, publisher, year, edition, pages
Uppsala: Acta Universitatis Upsaliensis, 2006. p. 38
Series
Digital Comprehensive Summaries of Uppsala Dissertations from the Faculty of Science and Technology, ISSN 1651-6214 ; 198
Keywords
Engineering physics, microelectromechanical system, interface, microfluidics, nanosatellite, space, microsystems, filter, valve, MST, MEMS, Teknisk fysik
Identifiers
urn:nbn:se:uu:diva-6954 (URN)91-554-6595-1 (ISBN)
Public defence
2006-06-07, Siegbahnsalen, Ångströmlaboratoriet, Lägerhyddsvägen 1, Polacksbacken, Uppsala, 10:15
Opponent
Supervisors
Available from: 2006-05-16 Created: 2006-05-16 Last updated: 2011-06-15Bibliographically approved

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Nguyen, HugoThornell, Greger

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