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A hybrid cold gas microthruster system suitable for low Δv applications on spacecraft have been developed. Microelectromechanical system (MEMS) components together with fine-mechanics form the microthruster units, intergrating four independent thrusters. These are designed to deliver maximum thrusts in the range of 0.1–10 mN.

The system includes three different micromachined subsystems: a nozzle unit comprising four nozzles generating supersonic gas velocity, i.e. 455 m/s, four independent piezoelectric proportional valves with leak rates at 10⁻⁶ scc/s He, and two particle filters. The performances of all these MEMS subsystems have been evaluated.

The total system performance has been estimated in two parameters, the system-specific impulse and the mass ratio of the propulsion system to the spacecraft mass. These figures provide input for spacecraft design and manufacture.

As fluidic microelectromechanical devices are developing and often attached to, or embedded in, large, complex and expensive systems, the issues of modularity, maintenance and subsystem replacement arise. In this work, a robust silicon connector suitable for high-pressure applications – likely with harsh fluids – in the temperature range of +100 to –100°C is demonstrated and tested together with a stainless steel nipple representing a simple and typical macropart. With a micromachined circular membrane equipped with a 5 μm high ridge, this connector is able to maintain a leak rate below 2.0´10^-8 scc/s of gaseous helium with a pressure of up to 9.7 bar. Degradation of the sealing performance on reassembly is associated with the indentation of the ridge. However, the ridge makes the sealing interface less sensitive to particles in comparison with a flat reference. Most evaluation is made through so called heat-until-leak tests conducted to determine the maximum working temperature and the sealing mechanism of the connector. A couple of these are followed by cryogenic testing. The effect of thermal mismatch of the components is discussed and utilized as an early warning mechanism.

In this work, a gas valve using a microstructured silicon valve lid and a stainless steel valve seat clamped axially together in an aluminum cylinder is investigated. The difference in coefficient of thermal expansion of these components makes the valve open and close on a temperature change. A simple model accounting for elastic deformation of the system’s components is proposed to facilitate design of the valve. By means of a helium leak detector, a typical increase in flow rate from 1.0×10⁻⁸ to 1.0×10⁻⁴ sccs gaseous helium under a pressure of up to 10 bars was observed upon the increase of temperature from 12 to around 98 °C, after a single breaking-in. Plastic deformation of the valve seat as a consequence of an imprint of the microstructured valve lid and contaminating particles was studied. Microscopy confirmed a tolerance for particles of up to a few micrometers in diameter. Larger particles were found to be a possible cause of failure.

The gas flow through a network of crossing thin micro-machined channels has been successfully modeled and simulated. The crossings are formed by two sets of v-grooves that intersect as two silicon wafers are bonded together. The gas is distributed from inlets via a manifold of channels to the narrow v-grooves. The narrow v-grooves could work as a particle filter. The fluidic model is derived from the Navier–Stokes equation and assumes laminar isothermal flow and incorporates small Knudsen number corrections and Poiseuille number calculations. The simulations use the finite element method. Several elements of the full crossing network model are treated separately before lumping them together: the straight v-grooves, a single crossing in an infinite set and a set of exactly four crossings along the flow path. The introduction of a crossing effectively corresponds to a virtual reduction of the length of the flow path, thereby defining a new effective length. The first and last crossings of each flow path together contribute to a pressure drop equal to that from three ordinary crossings. The derived full network model has been compared to previous experimental results on several differently shaped crossed v-groove networks. Within the experimental errors, the model corresponds to the mass flow and pressure drop measurements. The main error source is the uncertainty in v-groove width which has a profound impact on the fluidic behavior.

Demonstrated and investigated here is a method to seal microfluidic systems by soldering. As a particularly difficult case of growing importance, the sealing of openings contaminated with paraffin wax was studied. Solder paste, screen printed on a metallized silicon, substrate was melted locally through application of 6.5 to 10 V to a 5 Ω copper film resistor for a few seconds and found able to drive an intermediate layer of paraffin away and seal a 0.2 mm diameter circular via by wetting to a surrounding copper pad. Although verified to be robust, the process did result in failing seals on excessive heating because of consumption of the pads. Correctly performed, the technique provided a seal at least withstanding a pressure of 8 bar for 8 h at 85ºC.

Demonstrated and characterized here is a single use valve developed for high-pressure applications. Incorporated within the single use valve is a particle filter. The filter serves to remove any particle debris created by the activation process. The valve is solder sealed to be leakage proof. The solder is remelted to obtain activation of the valve. Local heater elements are incorporated on the valve surface together with solder wetting pads. The gas mass flow through the device was evaluated prior to sealing and after activation. The valve was functional at pressures of 100 bar, and opened in less than 10 s with an applied power of 13 W.