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An Adhesive Transfer Printing Technique with Tunable Elastomer Stamp for Scalable Fabrication of Stretchable Electronics
Huazhong University of Science and Technology.
Huazhong University of Science and Technology.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology. (Division of Microsystems Technology)ORCID iD: 0000-0003-0001-3197
2016 (English)Conference paper, Poster (Refereed)
Abstract [en]

This work reports a new type of the transfer printing with tunable adhesion of soft silicone elastomer stamp, which proved to be an effective and reliable technique to fabricate stretchable electronics. In our fabrication, a UV laser marker was introduced to direct write high-resolution circuits on the commercial available copper thin film. Further, this technique can be easily adapted to a mass production with a significant lower initiation cost of facility and infrastructure.The stretchable electronics is a multidisciplinary filed of electronics, mechanics and materials science. The most conductor, as an essential part of the electronic system, is hard brittle material. It is a challenging task that make the hard brittle material stretch. George Whitesides used sputtering method to process electrode in PDMS. Due to the stress does not match, there were many cracks in the metal after stretching [1]. The scholars in Princeton introduced a concept of pre stretching. When pre stretching PMDS is released, surface waves of thin gold films were made on an elastomeric substrate with built-in compressive stress. These waves can be stretched flat they function as elastic electrical conductors [2]. Then the scholars from the European union put forward a simple moulded-interconnect-device technology for the construction of elastic point-to-point interconnections, based on 2-D spring-shaped metallic tracks, which are embedded in a highly elastic silicone [3]. While Rogers from UIUC combined the SOI thin film circuits fabrication technique and silicone transferring technique by adjusting the adhesion force due to the speed of transferring stamp movement.In this work, by changing the adhesion of elastic base and the structure of copper, we achieved a high stretchable performance printed circuit boards. Using laser to cut the copper and getting the pattern. Then we use the ecoflex and pdms to manufacture the receiving substrate, which is gradient and ridge structure. By the viscosity difference between donor substrate and receiving substrate, the pattern copper can transfer from donor substrate to receiving substrate. Then the electronic component is integrated on the circuit. At the last, the electronic circuit is packaged.The strecyability can be reached 25% with 10000 cycyling with any failure.

[1] Bowden N, Brittain S, Evans A G, et al. Spontaneous formation of ordered structures in thin films of metals supported on an elastomeric polymer[J]. Nature, 1998, 393(6681):146--149.[2] Lacour S P, Wagner S, Huang Z, et al. Stretchable gold conductors on elastomeric substrates[J]. Applied Physics Letters, 2003, 82(15):2404-2406.[3] Brosteaux D, Axisa F, Gonzalez M, et al. Design and Fabrication of Elastic Interconnections for Stretchable Electronic Circuits[J]. IEEE Electron Device Letters, 2007, 28(7):552-554. 

Place, publisher, year, edition, pages
Boston: Cambridge University Press, 2016.
National Category
Materials Engineering
Identifiers
URN: urn:nbn:se:uu:diva-309856OAI: oai:DiVA.org:uu-309856DiVA: diva2:1053008
Conference
MRS Fall Meeting
Available from: 2016-12-07 Created: 2016-12-07 Last updated: 2017-01-25

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