High Resolution Patterning of Liquid Alloy by Shrinking the Substrate
2016 (English)Conference paper, Poster (Refereed)
In order to overcome the current limitation in the resolution of the previous developed, liquid alloy patterning method, a shrinking substrate is, for the first time, employed. The current printing technique combining spraying a liquid alloy and transferring a tape mask can be processed with a 100 μm level resolution. This is limited by the resolution of a mask fabricated by using a cutting plotter. By shrinking a substrate, a smaller scale of the liquid alloy pattern can be created without changing the current printing process with a tape mask, which has the advantage of quick and easy processing. We have found that the shrinking process by relaxing a radially 200% pre-strained substrate makes to increases twofold in the resolution of the liquid alloy line pattern.
Place, publisher, year, edition, pages
Cork: Institute of Physics (IOP), 2016.
IdentifiersURN: urn:nbn:se:uu:diva-309857OAI: oai:DiVA.org:uu-309857DiVA: diva2:1053010
Micromechanics and Microsystems Europe (MME)