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High Resolution Patterning of Liquid Alloy by Shrinking the Substrate
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology. (Division of Microsystems Technology)ORCID iD: 0000-0003-0001-3197
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences.
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2016 (English)Conference paper, Poster (with or without abstract) (Refereed)
Abstract [en]

In order to overcome the current limitation in the resolution of the previous developed, liquid alloy patterning method, a shrinking substrate is, for the first time, employed. The current printing technique combining spraying a liquid alloy and transferring a tape mask can be processed with a 100 μm level resolution. This is limited by the resolution of a mask fabricated by using a cutting plotter. By shrinking a substrate, a smaller scale of the liquid alloy pattern can be created without changing the current printing process with a tape mask, which has the advantage of quick and easy processing. We have found that the shrinking process by relaxing a radially 200% pre-strained substrate makes to increases twofold in the resolution of the liquid alloy line pattern.

Place, publisher, year, edition, pages
Cork: Institute of Physics (IOP), 2016.
National Category
Materials Engineering
Identifiers
URN: urn:nbn:se:uu:diva-309857OAI: oai:DiVA.org:uu-309857DiVA: diva2:1053010
Conference
Micromechanics and Microsystems Europe (MME)
Available from: 2016-12-07 Created: 2016-12-07 Last updated: 2017-01-25

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Jeong, Seung Hee
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