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Thin film metal sensors in fusion bonded glass chips for high-pressure microfluidics
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology.ORCID iD: 0000-0002-3966-0220
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology.
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2017 (English)In: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 27, no 1, 015018Article in journal (Refereed) Published
Abstract [en]

High-pressure microfluidics offers fast analyses of thermodynamic parameters for compressed process solvents. However, microfluidic platforms handling highly compressible supercritical CO2 are difficult to control, and on-chip sensing would offer added control of the devices. Therefore, there is a need to integrate sensors into highly pressure tolerant glass chips. In this paper, thin film Pt sensors were embedded in shallow etched trenches in a glass wafer that was bonded with another glass wafer having microfluidic channels. The devices having sensors integrated into the flow channels sustained pressures up to 220 bar, typical for the operation of supercritical CO2. No leakage from the devices could be found. Integrated temperature sensors were capable of measuring local decompression cooling effects and integrated calorimetric sensors measured flow velocities over the range 0.5-13.8 mm/s. By this, a better control of high-pressure microfluidic platforms has been achieved.

Place, publisher, year, edition, pages
2017. Vol. 27, no 1, 015018
Keyword [en]
supercritical carbon dioxide, high pressure microfluidics, integrated electrodes, temperature sensing, flow sensing, glass
National Category
Other Engineering and Technologies not elsewhere specified
Research subject
Engineering Science with specialization in Microsystems Technology
Identifiers
URN: urn:nbn:se:uu:diva-310063DOI: 10.1088/0960-1317/27/1/015018ISI: 000388703300003OAI: oai:DiVA.org:uu-310063DiVA: diva2:1054827
Funder
Swedish Research Council, 2011-5037VINNOVAKnut and Alice Wallenberg Foundation
Note

Part financed through Swedish Agency for the Innovation System, Vinnova, through the Centre for Natural Disaster Science (CNDS)

Available from: 2016-12-09 Created: 2016-12-09 Last updated: 2017-01-26Bibliographically approved

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The full text will be freely available from 2017-12-14 08:00
Available from 2017-12-14 08:00

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Andersson, MartinStocklassa, JesperSnögren, PärHjort, KlasKlintberg, Lena
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Citation style
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