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Quartz-to-quartz direct bonding
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Materials Science. Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Electronics.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Materials Science. Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Electronics.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Materials Science. Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Electronics.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Materials Science. Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Electronics.
1999 (English)In: Journal of the Electrochemical Society, ISSN 0013-4651, E-ISSN 1945-7111, Vol. 146, no 3, 1104-1105 p.Article in journal (Refereed) Published
Abstract [en]

Direct bonding of single crystalline quartz wafers is presented. By this straightforward technique, hermetical seals between quartz wafers can be formed. Nearly Z-cut (the Z-cut rotated 1 degrees 50') and AT-cut wafers bonded spontaneously at room tempera

Place, publisher, year, edition, pages
1999. Vol. 146, no 3, 1104-1105 p.
Keyword [en]
SILICON
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:uu:diva-84654DOI: 10.1149/1.1391728OAI: oai:DiVA.org:uu-84654DiVA: diva2:112562
Note

Addresses: Rangsten P, Univ Uppsala, Angstrom Lab, S-75121 Uppsala, Sweden. Univ Uppsala, Angstrom Lab, S-75121 Uppsala, Sweden. BCO Technol, Belfast BT11 8BU, Antrim, North Ireland.

Available from: 2007-02-28 Created: 2007-02-28 Last updated: 2017-12-14Bibliographically approved

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Vallin, ÖrjanBäcklund, Ylva

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