Computer modeling as a tool to predict deposition rate and film composition in the reactive sputtering process
1998 (English)In: JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, ISSN 0734-2101, Vol. 16, no 3, 1277-1285 p.Article in journal (Refereed) Published
Reactive sputtering is a widely used technique to deposit oxides, nitrides, etc. A serious drawback of this technique, however, is the drastic decrease in deposition rate that almost always occurs when depositing compound films as compared to depositing p
Place, publisher, year, edition, pages
1998. Vol. 16, no 3, 1277-1285 p.
Other Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:uu:diva-84695OAI: oai:DiVA.org:uu-84695DiVA: diva2:112603
Addresses: Berg S, Univ Uppsala, Angstrom Lab, S-75121 Uppsala, Sweden. Univ Uppsala, Angstrom Lab, S-75121 Uppsala, Sweden.2007-03-012007-03-012011-01-14