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Computer modeling as a tool to predict deposition rate and film composition in the reactive sputtering process
Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Materials Science. Department of Engineering Sciences, Electronics. Fasta tillståndets elektronik.
Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Materials Science. Department of Engineering Sciences, Electronics. Fasta tillståndets elektronik.
Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Materials Science. Department of Engineering Sciences, Electronics. Fasta tillståndets elektronik.
Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Materials Science. Department of Engineering Sciences, Electronics. Fasta tillståndets elektronik.
1998 (English)In: JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, ISSN 0734-2101, Vol. 16, no 3, 1277-1285 p.Article in journal (Refereed) Published
Abstract [en]

Reactive sputtering is a widely used technique to deposit oxides, nitrides, etc. A serious drawback of this technique, however, is the drastic decrease in deposition rate that almost always occurs when depositing compound films as compared to depositing p

Place, publisher, year, edition, pages
1998. Vol. 16, no 3, 1277-1285 p.
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:uu:diva-84695OAI: oai:DiVA.org:uu-84695DiVA: diva2:112603
Note
Addresses: Berg S, Univ Uppsala, Angstrom Lab, S-75121 Uppsala, Sweden. Univ Uppsala, Angstrom Lab, S-75121 Uppsala, Sweden.Available from: 2007-03-01 Created: 2007-03-01 Last updated: 2011-01-14

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Berg, SörenNyberg, TomasBlom, Hans-Olof

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