Passive and fixed alignment of devices using flexible silicon elements formed by selective etching
1998 (English)In: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 8, no 1, 39-44 p.Article in journal (Refereed) Published
Assembly systems consisting of aligning pits combined with flexible holding elements have been produced for both passive and fixed alignment of devices such as chips and optical fibres. The free-standing holding elements were fabricated in bulk silicon us
Place, publisher, year, edition, pages
1998. Vol. 8, no 1, 39-44 p.
Other Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:uu:diva-84703DOI: 10.1088/0960-1317/8/1/007OAI: oai:DiVA.org:uu-84703DiVA: diva2:112611
Addresses: Strandman C, Univ Uppsala, Angstrom Lab, Box 534, S-75121 Uppsala, Sweden. Univ Uppsala, Angstrom Lab, S-75121 Uppsala, Sweden.2007-03-012007-03-012012-09-28Bibliographically approved