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Dynamic Simulation of an Asymmetric Thermal Management Segment for Multilayered Silicon Microsystems
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology.
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2006 (English)In: IEEE Transactions on Components and Packaging TechnologiesArticle in journal (Refereed) Submitted
Place, publisher, year, edition, pages
National Category
Engineering and Technology
URN: urn:nbn:se:uu:diva-93962OAI: oai:DiVA.org:uu-93962DiVA: diva2:167626
Available from: 2006-01-19 Created: 2006-01-19 Last updated: 2016-06-23
In thesis
1. Integrated Communications and Thermal Management Systems for Microsystem-based Spacecraft: A Multifunctional Microsystem Approach
Open this publication in new window or tab >>Integrated Communications and Thermal Management Systems for Microsystem-based Spacecraft: A Multifunctional Microsystem Approach
2006 (English)Doctoral thesis, comprehensive summary (Other academic)
Abstract [en]

This thesis explores the potential of multifunctional silicon-based microsystems for advanced integrated nanospacecraft (AIN). Especially, multifunctional microsystems with the coexistant functions of communications and thermal management implemented in multilayer silicon stacks are approached with systems study. Host vehicles, composed of microsystems, including micro/nano-spacecraft and spherical rovers are contemplated with respect to future performance and implications, system level design, and breadboard realizations. A module of great importance, named the "integrated communications and thermal management system for advanced integrated spacecraft" or ICTM, symbolizes the achievements within the field of self-contained microsystems and is a prioritized entity throughout the thesis. The ICTM is natively placable onboard all types of highly miniaturized craft.

The single AIN spacecraft and future clusters of these are investigated with respect to future full scale implementation of space systems designed and implemented with the distributed reconfigurable nanospacecraft cluster (DRNC) concept. Here, a true entanglement of microsystems technology (MST) and miniaturized spacecraft technology can revolutionize the applications, cost, and span of conceivable space missions.

An intended communications scenario supporting a data rate of 1 Mbps, for the transmitter, is achieved during 6 minutes with a maximum continuous power dissipation of 10 W. Thermal simulations support the expectation, of a thermally biased ICTM, that the module is capable of supporting this energy burst, by using the mechanisms of heat storage and heat switches, and still fulfilling the requirements imposed by AIN type of spacecraft. In addition, multiple functional surfaces for the ICTM are evaluated with respect to equilibrium temperature and process compatibility. The tailored surfaces provide temperature control using micromachining methods.

A design of a micromachined Ka-band front end with several MST enabled features is presented including e.g. vias, phase-shifters, and antennas. Similar antennas have been manufactured resulting in an evaluation of ring- and slot-antennas on silicon substrate. Based on a primitive version of the ICTM, a S-band patch antenna has been successfully implemented and characterized. Included in the thesis is a microthruster, an enabling technology for DRNC.

Place, publisher, year, edition, pages
Uppsala: Acta Universitatis Upsaliensis, 2006. 45 p.
Digital Comprehensive Summaries of Uppsala Dissertations from the Faculty of Science and Technology, ISSN 1651-6214 ; 141
Electronics, nanospacecraft, MST, MEMS, silicon, communication, thermal management, antenna, paraffin, PCM, multifunctional, microsystems, Elektronik
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
urn:nbn:se:uu:diva-6316 (URN)91-554-6449-1 (ISBN)
Public defence
2006-02-10, Häggsalen, Ångströmlaboratoriet, Lägerhyddsvägen 1, Uppsala, 13:15
Available from: 2006-01-19 Created: 2006-01-19 Last updated: 2013-09-20Bibliographically approved

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