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Micromachined Loop Antennas for Low Resistivity Silicon Substrates
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Signal Processing.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology.
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2006 (English)In: IEEE Transactions on Antennas and Propagation, ISSN 0018-926X, E-ISSN 1558-2221, Vol. 54, no 12, 3593-3601 p.Article in journal (Refereed) Published
Abstract [en]

The integration of K-band (2040 GHz) full wavelength square wire- and slot-loop antennas on low resistivity (11-70 Omega cm) silicon substrates is addressed. By the use of polymer or silicon oxide/nitride membranes to support the slot or wire loop over micromachined trenches the efficiency of the antennas is enhanced while the majority of the bulk silicon within the apterture of the antenna is preserved to enable the integration of active devices. A 3.6 x 3.6 mm(2) large slot loop antenna chip with 200 mu m micromachined trench width yields 1.5 dBi gain at 29.5 GM, while 1.0 dBi gain is obtained at 24 GHz for a wire loop antenna on a 4.5 x 4.5 mm(2) large chip with 360 mu m wide trenches.

Place, publisher, year, edition, pages
2006. Vol. 54, no 12, 3593-3601 p.
Keyword [en]
loop antennas, micromachining, silicon, slot antennas
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:uu:diva-93965DOI: 10.1109/TAP.2006.886532ISI: 000242814800009OAI: oai:DiVA.org:uu-93965DiVA: diva2:167629
Available from: 2006-01-19 Created: 2006-01-19 Last updated: 2017-12-14Bibliographically approved
In thesis
1. Integrated Communications and Thermal Management Systems for Microsystem-based Spacecraft: A Multifunctional Microsystem Approach
Open this publication in new window or tab >>Integrated Communications and Thermal Management Systems for Microsystem-based Spacecraft: A Multifunctional Microsystem Approach
2006 (English)Doctoral thesis, comprehensive summary (Other academic)
Abstract [en]

This thesis explores the potential of multifunctional silicon-based microsystems for advanced integrated nanospacecraft (AIN). Especially, multifunctional microsystems with the coexistant functions of communications and thermal management implemented in multilayer silicon stacks are approached with systems study. Host vehicles, composed of microsystems, including micro/nano-spacecraft and spherical rovers are contemplated with respect to future performance and implications, system level design, and breadboard realizations. A module of great importance, named the "integrated communications and thermal management system for advanced integrated spacecraft" or ICTM, symbolizes the achievements within the field of self-contained microsystems and is a prioritized entity throughout the thesis. The ICTM is natively placable onboard all types of highly miniaturized craft.

The single AIN spacecraft and future clusters of these are investigated with respect to future full scale implementation of space systems designed and implemented with the distributed reconfigurable nanospacecraft cluster (DRNC) concept. Here, a true entanglement of microsystems technology (MST) and miniaturized spacecraft technology can revolutionize the applications, cost, and span of conceivable space missions.

An intended communications scenario supporting a data rate of 1 Mbps, for the transmitter, is achieved during 6 minutes with a maximum continuous power dissipation of 10 W. Thermal simulations support the expectation, of a thermally biased ICTM, that the module is capable of supporting this energy burst, by using the mechanisms of heat storage and heat switches, and still fulfilling the requirements imposed by AIN type of spacecraft. In addition, multiple functional surfaces for the ICTM are evaluated with respect to equilibrium temperature and process compatibility. The tailored surfaces provide temperature control using micromachining methods.

A design of a micromachined Ka-band front end with several MST enabled features is presented including e.g. vias, phase-shifters, and antennas. Similar antennas have been manufactured resulting in an evaluation of ring- and slot-antennas on silicon substrate. Based on a primitive version of the ICTM, a S-band patch antenna has been successfully implemented and characterized. Included in the thesis is a microthruster, an enabling technology for DRNC.

Place, publisher, year, edition, pages
Uppsala: Acta Universitatis Upsaliensis, 2006. 45 p.
Series
Digital Comprehensive Summaries of Uppsala Dissertations from the Faculty of Science and Technology, ISSN 1651-6214 ; 141
Keyword
Electronics, nanospacecraft, MST, MEMS, silicon, communication, thermal management, antenna, paraffin, PCM, multifunctional, microsystems, Elektronik
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:uu:diva-6316 (URN)91-554-6449-1 (ISBN)
Public defence
2006-02-10, Häggsalen, Ångströmlaboratoriet, Lägerhyddsvägen 1, Uppsala, 13:15
Opponent
Supervisors
Available from: 2006-01-19 Created: 2006-01-19 Last updated: 2013-09-20Bibliographically approved
2. Integrated Antennas: Monolithic and Hybrid Approaches
Open this publication in new window or tab >>Integrated Antennas: Monolithic and Hybrid Approaches
2006 (English)Doctoral thesis, comprehensive summary (Other academic)
Abstract [en]

This thesis considers integration of antennas and active electronics manufactured on the same substrate. The main topic is on-chip antennas for commercial silicon processes, but hybrid integration using printed circuit board technology is also addressed.

The possible use of micromachining techniques as a means of reducing substrate losses of antennas manufactured on low resistivity silicon wafers is investigated. Compact dipole, loop, and inverted-F antennas for the 20-40 GHz frequency range are designed, implemented, and characterized. The results show significantly improved antenna efficiency when micromachining is used as a post-processing step for on-chip antennas manufactured in silicon technology.

High resistivity wafers are used in a commercial silicon germanium technology to improve the efficiency of dipole antennas realized using the available circuit metal layers in the process. Monolithically integrated 24 GHz receivers with on-chip antennas are designed and evaluated with regard to antenna and system performance. No noticeable degradation of the receiver performance caused by cross talk between the antenna and the integrated circuit is observed.

For low frequency antenna arrays, such as base station antennas, hybrid integration of active devices within the antenna aperture is treated. A compact varactor based phase shifter for traveling wave antenna applications is proposed and evaluated. Electrically steerable traveling wave patch antenna arrays, with the phase shifters implemented in the same conductor layer as the radiating elements, are designed and manufactured in microstrip technology. It is experimentally verified that the radiation from the feed network and phase shifters in the proposed antenna configuration is small.

Place, publisher, year, edition, pages
Uppsala: Acta Universitatis Upsaliensis, 2006. 69 p.
Series
Digital Comprehensive Summaries of Uppsala Dissertations from the Faculty of Science and Technology, ISSN 1651-6214 ; 221
Keyword
Electronics, antenna travelling wave arrays, antenna phased arrays, phase shifters, micromachining, silicon, monolithic microwave integrated circuits, dipole antennas, loop antennas, slot antennas, Elektronik
Identifiers
urn:nbn:se:uu:diva-7142 (URN)91-554-6651-6 (ISBN)
Public defence
2006-10-13, Siegbahnsalen, Ångströmlaboratoriet, Lägerhyddsv. 1, Uppsala, 10:15
Opponent
Supervisors
Available from: 2006-09-22 Created: 2006-09-22 Last updated: 2013-05-17Bibliographically approved

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