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Microsystem interfaces to the macroscopic surroundings and within the microsystems themselves are formidable challenges that this thesis makes an effort to overcome, specifically for enabling a spacecraft based entirely on microsystems. The NanoSpace-1 nanospacecraft is a full-fledged satellite design with mass below 10 kg. The high performance with respect to mass is enabled by a massive implementation of microsystem technology – the entire spacecraft structure is built from square silicon panels that allow for efficient microsystem integration. The panels comprise bonded silicon wafers, fitted with silicone rubber gaskets into aluminium frames. Each module of the spacecraft is added in a way that strengthens and stiffens the overall spacecraft structure.

The structural integrity of the silicon module as a generic building block has been successfully proven. The basic design (silicon, silicone, aluminium) survived considerable mechanical loads, where the silicon material contributed significantly to the strength of the structural element. Structural modeling of the silicon building blocks enables rapid iterative design of e.g. spacecraft structures by the use of pertinent model simplifications.

Other microsystem interfaces treats fluidic, thermal, and mechanical functions. First, solder sealing of microsystem cavities was demonstrated, using screen-printed solder and localized resistive heating in the microsystem interface. Second, a dismountable fluidic microsystem connector, using a ridged silicon membrane, intended for monopropellant thruster systems, was developed. Third, a thermally regulated microvalve for minute flows, made by a silicon ridge imprint in a stainless steel nipple, was investigated. Finally, particle filters for gas interfaces to microsystems, or between parts of fluidic microsystems, were made from sets of crossed v-grooves in the interface of a bonded silicon wafer stack. Filter manufacture, mass flow and pressure drop characterization, together with numeric modeling for filter design, was performed.

All in all this reduces the weight and volume when microsystems are interfaced in their applications.