Logo: to the web site of Uppsala University

This thesis considers integration of antennas and active electronics manufactured on the same substrate. The main topic is on-chip antennas for commercial silicon processes, but hybrid integration using printed circuit board technology is also addressed.

The possible use of micromachining techniques as a means of reducing substrate losses of antennas manufactured on low resistivity silicon wafers is investigated. Compact dipole, loop, and inverted-F antennas for the 20-40 GHz frequency range are designed, implemented, and characterized. The results show significantly improved antenna efficiency when micromachining is used as a post-processing step for on-chip antennas manufactured in silicon technology.

High resistivity wafers are used in a commercial silicon germanium technology to improve the efficiency of dipole antennas realized using the available circuit metal layers in the process. Monolithically integrated 24 GHz receivers with on-chip antennas are designed and evaluated with regard to antenna and system performance. No noticeable degradation of the receiver performance caused by cross talk between the antenna and the integrated circuit is observed.

For low frequency antenna arrays, such as base station antennas, hybrid integration of active devices within the antenna aperture is treated. A compact varactor based phase shifter for traveling wave antenna applications is proposed and evaluated. Electrically steerable traveling wave patch antenna arrays, with the phase shifters implemented in the same conductor layer as the radiating elements, are designed and manufactured in microstrip technology. It is experimentally verified that the radiation from the feed network and phase shifters in the proposed antenna configuration is small.

This thesis presents various integrated antenna solutions for different types of systems and applications, e.g. wireless sensors, broadband handsets, advanced base stations, MEMS-based reconfigurable front-ends, automotive anti-collision radars, and large area electronics.

For wireless sensor applications, a T-matched dipole is proposed and integrated in an electrically small body-worn sensor node. Measurement techniques are developed to characterize the port impedance and radiation properties. Possibilities and limitations of the planar inverted cone antenna (PICA) for small handsets are studied experimentally. Printed slot-type and folded PICAs are demonstrated for UWB handheld terminals.

Both monolithic and hybrid integration are applied for electrically steerable array antennas. Compact phase shifters within a traveling wave array antenna architecture, on single layer substrate, is investigated for the first time. Radio frequency MEMS switches are utilized to improve the performance of reconfigurable antennas at higher frequencies. Using monolithic integration, a 20 GHz switched beam antenna based on MEMS switches is implemented and evaluated. Compared to similar work published previously, complete experimental results are here for the first time reported. Moreover, a hybrid approach is used for a 24 GHz switched beam traveling wave array antenna. A MEMS router is fabricated on silicon substrate for switching two array antennas on a LTCC chip.

A concept of nano-wire based substrate integrated waveguides (SIW) is proposed for millimeter-wave applications. Antenna prototypes based on this concept are successfully demonstrated for automotive radar applications.

W-band body-worn nonlinear harmonic radar reflectors are proposed as a means to improve automotive radar functionality. Passive, semi-passive and active nonlinear reflectors consisting of array antennas and nonlinear circuitry on flex foils are investigated.

A new stretchable RF electronics concept for large area electronics is demonstrated. It incorporates liquid metal into microstructured elastic channels. The prototypes exhibit high stretchability, foldability, and twistability, with maintained electrical properties.