A PCB-like Process for Vertically Configured Thermopiles
2008 (English)In: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 18, no 6, 065021- p.Article in journal (Refereed) Published
Thermopiles are important components in infrared thermal detectors, thermoelectric generators and thermoelectric coolers. We present a thermopile structure with up to 224 vertically arranged thermocouple legs in a polyimide flex material. The thermopile is optimized for infrared thermal radiation detection and is fabricated using printed circuit board-like (PCB-like) processing. Each thermoelectric leg consists of a bundle of a few hundred sub-micrometre-sized strands of either antimony or nickel. These metal wire bundles were achieved by employing ion track technology on the polyimide foil, resulting in a porous dielectric material. Electrochemical methods were used to grow the thermoelectric materials in the pores. The plating mask was produced in a laminated dry photoresist. A small metal cross section, 20 mu m(2) (1 vol%), ensured a low heat exchange between the two surfaces of the flex. The typical resistance per thermocouple was 34 Omega. A responsivity to irradiance of 4.3 V mm(2) W(-1) was measured when heating with a white light source (irradiance 1 mW mm(-2)).
Place, publisher, year, edition, pages
2008. Vol. 18, no 6, 065021- p.
Engineering and Technology
IdentifiersURN: urn:nbn:se:uu:diva-96878DOI: 10.1088/0960-1317/18/6/065021ISI: 000256619600039OAI: oai:DiVA.org:uu-96878DiVA: diva2:171606