uu.seUppsala University Publications
Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
A PCB-like Process for Vertically Configured Thermopiles
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Micro Structural Technology.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Micro Structural Technology.
Show others and affiliations
2008 (English)In: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 18, no 6, 065021- p.Article in journal (Refereed) Published
Abstract [en]

Thermopiles are important components in infrared thermal detectors, thermoelectric generators and thermoelectric coolers. We present a thermopile structure with up to 224 vertically arranged thermocouple legs in a polyimide flex material. The thermopile is optimized for infrared thermal radiation detection and is fabricated using printed circuit board-like (PCB-like) processing. Each thermoelectric leg consists of a bundle of a few hundred sub-micrometre-sized strands of either antimony or nickel. These metal wire bundles were achieved by employing ion track technology on the polyimide foil, resulting in a porous dielectric material. Electrochemical methods were used to grow the thermoelectric materials in the pores. The plating mask was produced in a laminated dry photoresist. A small metal cross section, 20 mu m(2) (1 vol%), ensured a low heat exchange between the two surfaces of the flex. The typical resistance per thermocouple was 34 Omega. A responsivity to irradiance of 4.3 V mm(2) W(-1) was measured when heating with a white light source (irradiance 1 mW mm(-2)).

Place, publisher, year, edition, pages
2008. Vol. 18, no 6, 065021- p.
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:uu:diva-96878DOI: 10.1088/0960-1317/18/6/065021ISI: 000256619600039OAI: oai:DiVA.org:uu-96878DiVA: diva2:171606
Projects
wisenet
Available from: 2008-03-19 Created: 2008-03-19 Last updated: 2017-12-14Bibliographically approved
In thesis
1. High Aspect Ratio Microstructures in Flexible Printed Circuit Boards: Process and Applications
Open this publication in new window or tab >>High Aspect Ratio Microstructures in Flexible Printed Circuit Boards: Process and Applications
2008 (English)Doctoral thesis, comprehensive summary (Other academic)
Abstract [en]

Flexible printed circuit boards (flex PCBs) are used in a wide range of electronic devices today due to their light weight, bendability, extensive wiring possibilities, and low-cost manufacturing techniques. The general trend in the flex PCB industry is further miniaturization alongside increasing functionality per device and reduced costs. To meet these demands, a new generation of low cost manufacturing technologies is being developed to enable structures with smaller lateral dimensions and higher packing densities.

Wet etching is today the most cost-efficient method for producing a large number of through-foil structures in flex PCBs. However, conventional wet etch techniques do not allow for through-foil structures with aspect ratios over 1 – a fact that either necessitates thin and mechanically weak foils or puts severe limitations on the packing density. The fabrication techniques presented in this thesis allow for through-foil structures with higher aspect ratios and packing densities using wet etching. To achieve high aspect ratios with wet etching, the flex PCB foils are pre-treated with irradiation by swift heavy ions. Each ion that passes through the foil leaves a track of damaged material which can be subsequently etched to form highly vertical pores. By using conventional flex PCB process techniques on the porous foils, high aspect ratio metallized through-foil structures are demonstrated.

The resulting structures consist of multiple sub-micrometer sized wires. These structures are superior to their conventional counterparts when it comes to their higher aspect ratios, higher possible packing densities and low metallic cross-section. Furthermore, metallized through-foil structures with larger areas and more complicated geometries are possible without losing the mechanical stability of the foil. This in turn enables applications that are not possible using conventional techniques and structures. In this thesis, two such applications are demonstrated: flex PCB vertical thermopile sensors and substrate integrated waveguides for use in millimeter wave applications.

Place, publisher, year, edition, pages
Uppsala: Acta Universitatis Upsaliensis, 2008. 58 p.
Series
Digital Comprehensive Summaries of Uppsala Dissertations from the Faculty of Science and Technology, ISSN 1651-6214 ; 407
Keyword
Engineering physics, flexible printed circuit boards, polyimide, through-hole vias, ion track technology, thermoelectricity, thermopiles, substrate integrated waveguides, millimeter wave devices, Teknisk fysik
National Category
Other Engineering and Technologies
Identifiers
urn:nbn:se:uu:diva-8565 (URN)978-91-554-7127-9 (ISBN)
Public defence
2008-04-11, SiegbahnSalen, Ångströmlaboratoriet, Lägerhyddsvägen 1, Uppsala, 09:30
Opponent
Supervisors
Projects
wisenet
Available from: 2008-03-19 Created: 2008-03-19 Last updated: 2011-01-17Bibliographically approved

Open Access in DiVA

No full text

Other links

Publisher's full text

Authority records BETA

Lindeberg, MikaelYousef, HannaHjort, Klas

Search in DiVA

By author/editor
Lindeberg, MikaelYousef, HannaHjort, Klas
By organisation
Micro Structural Technology
In the same journal
Journal of Micromechanics and Microengineering
Engineering and Technology

Search outside of DiVA

GoogleGoogle Scholar

doi
urn-nbn

Altmetric score

doi
urn-nbn
Total: 998 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf