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The quest for material-efficient Cu(In,Ga)Se-2 (CIGS) solar cells encourages the development of ultra-thin absorbers. Their use reduces material consumption and energy usage during production by increasing the throughput. Thereby, both the bill of materials as well as the energy and capital costs are reduced. However, because thin absorbers are prone to increase back contact recombination, back surface passivation schemes are necessary to reach a similar or higher conversion efficiency than for absorbers with conventional thickness. Here, we investigate nanostructured hafnium oxide (HfO2) rear passivation layers for ultra-thin CIGS solar cells. We fabricate regular arrays of point contacts with 200 nm diameter through HfO2 layers with thicknesses between 7 and 40 nm using electron beam lithography and reactive ion etching. The current-voltage curves of solar cells with a 500 nm thick CIGS absorber layer and the nanostructured passivation layer show improved performance concerning V-oc and J(sc) compared to non-passivated reference devices. Furthermore, external quantum efficiency and optical reflection confirm an effective passivation behavior, with an average efficiency increase of up to 1.2% for the cells with the 40 nm thick HfO2 layer. In addition, simulation work shows that even 40 nm thick HfO2 passivation layers have only a minimal effect on the optical properties of ultra-thin CIGS solar cells, and hence, the photocurrent increase verified experimentally stems from electrical improvements caused by the HfO2 layer passivation effect. We also investigate the impact of ultra-thin (0.3, 0.6, 1.3, and 2.5 nm) non-patterned HfO2 passivation layers on the same type of solar cells. However, these results showed no improvement in solar cell performance, despite an increase in the current density with layer thickness.