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High aspect ratio “multiple wire” microvias in flexible PCBs
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology.
2009 (English)In: Circuit world, ISSN 0305-6120, E-ISSN 1758-602X, Vol. 35, no 4, 18-21 p.Article in journal (Refereed) Published
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2009. Vol. 35, no 4, 18-21 p.
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Engineering and Technology
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URN: urn:nbn:se:uu:diva-111688DOI: 10.1108/03056120911002370ISI: 000273205400002OAI: oai:DiVA.org:uu-111688DiVA: diva2:282467
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wisenet
Available from: 2009-12-21 Created: 2009-12-21 Last updated: 2016-04-14

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Lindeberg, MikaelHjort, Klas

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