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High rate copper deposition using gasless HiPIMS
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Solid State Electronics.
Plasma Applications Group, Lawrence Berkley National Laboratory.
2010 (English)Conference paper (Refereed)
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Physical Sciences Engineering and Technology
URN: urn:nbn:se:uu:diva-141333OAI: oai:DiVA.org:uu-141333DiVA: diva2:385423
International Conference on metallurgical coatings and thin films ICMCTF 2010, April 26-30, 2010, San Diego, CA, USA
Available from: 2011-01-11 Created: 2011-01-11 Last updated: 2016-04-18Bibliographically approved

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