Microstructure and electrical properties of Ti-Si-C-Ag nanocomposite thin films
2007 (English)In: Surface & Coatings Technology, ISSN 0257-8972, E-ISSN 1879-3347, Vol. 201, no 14, 6465-6469 p.Article in journal (Refereed) Published
Ti-Si-C-Ag nanocomposite coatings consisting of nanocrystalline TiC in an amorphous Si matrix with segregated Ag were deposited by dual magnetron sputtering from Ti3SiC2 and Ag targets. As evidenced by X-ray diffraction, scanning electron microscopy, and transmission electron microscopy, for Ag contents below 10 at.%, the Ag forms similar to 10 nm large crystallites that are homogeneously distributed in the films. For higher Ag contents, coalescence during growth results in the formation of > similar to 100 nm Ag islands on the film surface. The electrical resistivity of the coatings was measured in a four-point-probe setup, and ranged from 340 mu Omega cm (for Ti-Si-C coatings without Ag) to 40 mu Omega cm (for high Ag content).
Place, publisher, year, edition, pages
2007. Vol. 201, no 14, 6465-6469 p.
sputtering, titanium carbide, silver, resistivity, X-ray diffraction, electron microscopy
IdentifiersURN: urn:nbn:se:uu:diva-145489DOI: 10.1016/j.surfcoat.2006.12.016ISI: 000245065200039OAI: oai:DiVA.org:uu-145489DiVA: diva2:396271