Epitaxy of Ultrathin NiSi2 Films with Predetermined Thickness
2011 (English)In: Electrochemical and solid-state letters, ISSN 1099-0062, E-ISSN 1944-8775, Vol. 14, no 7, H268-H270 p.Article in journal (Refereed) Published
This letter presents a proof-of-concept process for tunable, self-limiting growth of ultrathin epitaxial NiSi2 films on Si (100). The process starts with metal sputter-deposition, followed by wet etching and then silicidation. By ionizing a fraction of the sputtered Ni atoms and biasing the Si substrate, the amount of Ni atoms incorporated in the substrate after wet etching can be controlled. As a result, the thickness of the NiSi2 films is increased from 4.7 to 7.2 nm by changing the nominal substrate bias from 0 to 600 V. The NiSi2 films are characterized by a specific resistivity around 50 mu Omega cm.
Place, publisher, year, edition, pages
2011. Vol. 14, no 7, H268-H270 p.
Engineering and Technology
Research subject Engineering Science with specialization in Electronics
IdentifiersURN: urn:nbn:se:uu:diva-154110DOI: 10.1149/1.3580618ISI: 000290276400013OAI: oai:DiVA.org:uu-154110DiVA: diva2:419382