Diffusion Phase Formation in the Cu-Sn Nanofilms System
2011 (English)In: Grain Boundary Diffusion, Stresses and Segregation / [ed] Bokstein, B. S., Rodin, A. O. & Straumal, B. B., 2011, Vol. 309-310, 167-176 p.Conference paper (Other academic)
Processes involved in the structure and phase formation in the thin film systems Sn(4 nm)/Cu(14 nm) and Cu(14 nm)/Sn(8 nm) in the temperature range 130-500 degrees C were studied using "in situ" electron imaging and Transmission Electron Microscopy methods (TEM). Solubility of Sn alpha - solid solution Cu-Sn has been determined from the changes in the lattice parameter. This work was performed in the framework of the Swedish Institute supported cooperative research project "Thin metal films - the interplay of structure diffusion and boundaries" (SI dnr 00699/2009).
Place, publisher, year, edition, pages
2011. Vol. 309-310, 167-176 p.
, Defect and Diffusion Forum Series, ISSN 1012-0386 ; 309-310
thin films, phase formation, diffusion, lattice parameter, reaction
IdentifiersURN: urn:nbn:se:uu:diva-156022DOI: 10.4028/www.scientific.net/DDF.309-310.167ISI: 000291709300020ISBN: 978-3-03785-055-8OAI: oai:DiVA.org:uu-156022DiVA: diva2:429892
International Conference on Grain Boundary Diffusion, Stresses and Segregation, Moscow, Russia, Jun 01-04, 2010