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Hysteresis and process stability in reactive high power impulse magnetron sputtering of metal oxides
Plasma & Coatings Physics Division, IFM, Material Physics, Linköping University.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Solid State Electronics.
Plasma & Coatings Physics Division, IFM, Material Physics, Linköping University.
Plasma & Coatings Physics Division, IFM, Material Physics, Linköping University.
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2011 (English)In: Thin Solid Films, ISSN 0040-6090, E-ISSN 1879-2731, Vol. 519, no 22, 7779-7784 p.Article in journal (Refereed) Published
Abstract [en]

In the further development of reactive sputter deposition, strategies which allow for stabilization of the transition zone between the metallic and compound modes, elimination of the process hysteresis, and increase of the deposition rate, are of particular interest. In this study, the hysteresis behavior and the characteristics of the transition zone during reactive high power impulse magnetron sputtering (HiPIMS) of Al and Ce targets in an Ar-O(2) atmosphere as a function of the pulsing frequency and the pumping speed are investigated. Comparison with reactive direct current magnetron sputtering (DCMS) reveals that HiPIMS allows for elimination/suppression of the hysteresis and a smoother transition from the metallic to the compound sputtering mode. For the experimental conditions employed in the present study, optimum behavior with respect to the hysteresis width is obtained at frequency values between 2 and 4 kHz, while HiPIMS processes with values below or above this range resemble the DCMS behavior. Al-O films are deposited using both HiPIMS and DCMS. Analysis of the film properties shows that elimination/suppression of the hysteresis in HiPIMS facilitates the growth of stoichiometric and transparent Al(2)O(3) at relatively high deposition rates over a wider range of experimental conditions as compared to DCMS.

Place, publisher, year, edition, pages
2011. Vol. 519, no 22, 7779-7784 p.
Keyword [en]
Reactive sputtering, High power impulse magnetron sputtering, Aluminum oxide, Cerium oxide, Hysteresis, Process stability
National Category
Engineering and Technology
Research subject
Engineering Science with specialization in Electronics
Identifiers
URN: urn:nbn:se:uu:diva-161069DOI: 10.1016/j.tsf.2011.06.021ISI: 000295057000027OAI: oai:DiVA.org:uu-161069DiVA: diva2:456350
Available from: 2011-11-14 Created: 2011-11-07 Last updated: 2017-12-08Bibliographically approved

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Kubart, Tomas

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