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Design of high frequency piezoelectric resonators utilizing laterally propagating fast modes in thin aluminum nitride (AlN) films
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Solid State Electronics.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Solid State Electronics.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Solid State Electronics.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Solid State Electronics.
2006 (English)In: Ultrasonics, ISSN 0041-624X, E-ISSN 1874-9968, Vol. 45, no 1-4, 208-212 p.Article in journal (Refereed) Published
Abstract [en]

Highly c-oriented aluminum nitride (AlN) thin piezoelectric films have been grown by pulsed direct-current (DC) magnetron reactive sputter deposition. The films were deposited at room temperature and had a typical full width half maximum (FWHM) value of the (0 0 2) rocking curve of around 2°. Resonant devices in thin film plates having surface acoustic wave (SAW) based designs were fabricated by means of low resolution photolithography. The devices were designed to operate with the fast Rayleigh and Lamb modes respectively. Both types of devices exhibited propagation velocities in excess of 10 000 m/s and sufficient electromechanical couplings. The device measurements illustrate the big potential of these modes for the development of low cost IC compatible electroacoustic devices in the lower GHz range. The basic properties of the modes studied are discussed in a comparative manner. Potential commercial applications are also outlined.

Place, publisher, year, edition, pages
2006. Vol. 45, no 1-4, 208-212 p.
Keyword [en]
AlN, Resonator, SAW, Lamb, Sputtering, Integrated devices
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:uu:diva-23528DOI: 10.1016/j.ultras.2006.09.008ISI: 000243241800025OAI: oai:DiVA.org:uu-23528DiVA: diva2:51302
Available from: 2007-01-30 Created: 2009-01-26 Last updated: 2017-12-07Bibliographically approved
In thesis
1. Fabrication of Electroacoustic Devices for Integrated Applications
Open this publication in new window or tab >>Fabrication of Electroacoustic Devices for Integrated Applications
2009 (English)Doctoral thesis, comprehensive summary (Other academic)
Abstract [en]

Electroacoustic technology has in many ways revolutionised the wireless telecommunication industry. The IC compatible fabrication technique of thin film electroacoustic devices has so far provided a considerable increase in device performance and reduction in size. At the moment, new areas where this technology can be of use is under investigation. In particular, thin film bulk acoustic wave resonators are promising candidates for biochemical and gravimetric sensor applications.

For bulk acoustic waves, the thesis addresses a number of aspects in the design, fabrication, characterisation, and integration of thin film electroacoustic devices. The object of the studies conducted in the thesis has been to improve on design and thereby optimise the performance of the device to fit a particular application of interest. For high frequency and high power applications, a conceptually new design of the solidly mounted resonator has been investigated. A 1 GHz plate wave resonator with a much higher Q factor than its surface acoustic counterpart have also been fabricated. A multi-chip-module 2 GHz microwave oscillator featuring a monolithically integrated solidly mounted resonator and a flip chip transistor have been fabricated and characterised with a phase noise of -125 dBc/Hz at 100 kHz. For sensor applications, the fabrication of shear mode solidly mounted resonators featuring c-axis inclined AlN films has been studied. A process for the bonding of a microfluidic system on top of the resonator has been realised. Further, the effect of conductive liquids on the resonator performance has been investigated.For surface acoustic wave devices, acoustic manipulation of particles in microfluidic channels has been studied. Two functional devices have been fabricated by bonding piezoelectric substrates to glass or fused silica superstrates. By generating an interface acoustic wave, that propagates along the bonded interface, manipulation of sub-micrometer particles was realised.

Place, publisher, year, edition, pages
Uppsala: Acta Universitatis Upsaliensis, 2009. 70 p.
Series
Digital Comprehensive Summaries of Uppsala Dissertations from the Faculty of Science and Technology, ISSN 1651-6214 ; 631
National Category
Other Engineering and Technologies
Research subject
Electronics
Identifiers
urn:nbn:se:uu:diva-100381 (URN)978-91-554-7487-4 (ISBN)
Public defence
2009-05-15, Siegbahnsalen, Ångström laboratory, Uppsala, 09:30 (English)
Supervisors
Projects
wisenet
Available from: 2009-04-24 Created: 2009-03-31 Last updated: 2011-01-17Bibliographically approved

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Yantchev, VentsislavEnlund, JohannesBjurström, JohanKatardjiev, Ilia

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