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Ion track lithography: novel low-cost process to form deep vertical and high aspect ratio MEMS in flexible laminates
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences. Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Materials Science.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences. Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Materials Science.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences. Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Materials Science.
2003 (English)In: DTIP, the symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, Cannes, France, 5-7 May 2003, 2003, 314-320 p.Conference paper, Published paper (Refereed)
Place, publisher, year, edition, pages
2003. 314-320 p.
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Engineering and Technology
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URN: urn:nbn:se:uu:diva-23876OAI: oai:DiVA.org:uu-23876DiVA: diva2:51650
Available from: 2007-02-01 Created: 2007-02-01 Last updated: 2009-08-21Bibliographically approved

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CiteExportLink to record
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Citation style
  • apa
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Language
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