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Low-temperature wafer direct bonding by surface modification in vacuum
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2002 (English)In: The 16th Symposium of the Japanese Institute of Electronics, Tokyo, Japan, March 18-20, 2002Conference paper, Published paper (Refereed)
Place, publisher, year, edition, pages
2002.
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Other Electrical Engineering, Electronic Engineering, Information Engineering
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URN: urn:nbn:se:uu:diva-26617OAI: oai:DiVA.org:uu-26617DiVA: diva2:54391
Available from: 2008-06-13 Created: 2008-06-13

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Vallin, Örjan

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