uu.seUppsala University Publications
Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
Liquid alloy printing of microfluidic stretchable electronics
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology.
KTH, Hållfasthetslära, Stockholm.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Solid State Electronics.
Show others and affiliations
2012 (English)In: Lab on a Chip, ISSN 1473-0197, E-ISSN 1473-0189, Vol. 22, no 12, 4657-4664 p.Article in journal (Refereed) Published
Abstract [en]

Recently, microfluidic stretchable electronics has attracted great interest from academia since conductive liquids allow for larger cross-sections when stretched and hence low resistance at longer lengths. However, as a serial process it has suffered from low throughput, and a parallel processing technology is needed for more complex systems and production at low costs. In this work, we demonstrate such a technology to implement microfluidic electronics by stencil printing of a liquid alloy onto a semi-cured polydimethylsiloxane (PDMS) substrate, assembly of rigid active components, encapsulation by pouring uncured PDMS on-top and subsequent curing. The printing showed resolution of 200 mm and linear resistance increase of the liquid conductors when elongated up to 60%. No significant change of resistance was shown for a circuit with one LED after 1000 times of cycling between a 0% and an elongation of 60% every 2 s. A radio frequency identity (RFID) tag was demonstrated using the developed technology, showing that good performance could be maintained well into the radio frequency (RF) range.

Place, publisher, year, edition, pages
Royal society of chemistry , 2012. Vol. 22, no 12, 4657-4664 p.
Keyword [en]
liquid alloy, printing, stretchable electronics, wireless communication
National Category
Electrical Engineering, Electronic Engineering, Information Engineering Other Materials Engineering
Research subject
Engineering Science with specialization in Microsystems Technology; Engineering Science with specialization in Electronics
Identifiers
URN: urn:nbn:se:uu:diva-183278DOI: 10.1039/C2LC40628DISI: 000310865200010OAI: oai:DiVA.org:uu-183278DiVA: diva2:562295
Available from: 2012-10-23 Created: 2012-10-23 Last updated: 2017-12-07Bibliographically approved
In thesis
1. Soft Intelligence: Liquids Matter in Compliant Microsystems
Open this publication in new window or tab >>Soft Intelligence: Liquids Matter in Compliant Microsystems
2016 (English)Doctoral thesis, comprehensive summary (Other academic)
Abstract [en]

Soft matter, here, liquids and polymers, have adaptability to a surrounding geometry. They intrinsically have advantageous characteristics from a mechanical perspective, such as flowing and wetting on surrounding surfaces, giving compliant, conformal and deformable behavior. From the behavior of soft matter for heterogeneous surfaces, compliant structures can be engineered as embedded liquid microstructures or patterned liquid microsystems for emerging compliant microsystems.

Recently, skin electronics and soft robotics have been initiated as potential applications that can provide soft interfaces and interactions for a human-machine interface. To meet the design parameters, developing soft material engineering aimed at tuning material properties and smart processing techniques proper to them are to be highly encouraged. As promising candidates, Ga-based liquid alloys and silicone-based elastomers have been widely applied to proof-of-concept compliant structures.

In this thesis, the liquid alloy was employed as a soft and stretchable electrical and thermal conductor (resistor), interconnect and filler in an elastomer structure. Printing-based liquid alloy patterning techniques have been developed with a batch-type, parallel processing scheme. As a simple solution, tape transfer masking was combined with a liquid alloy spraying technique, which provides robust processability. Silicone elastomers could be tunable for multi-functional building blocks by liquid or liquid-like soft solid inclusions. The liquid alloy and a polymer additive were introduced to the silicone elastomer by a simple mixing process. Heterogeneous material microstructures in elastomer networks successfully changed mechanical, thermal and surface properties.

To realize a compliant microsystem, these ideas have in practice been useful in designing and fabricating soft and stretchable systems. Many different designs of the microsystems have been fabricated with the developed techniques and materials, and successfully evaluated under dynamic conditions. The compliant microsystems work as basic components to build up a whole system with soft materials and a processing technology for our emerging society.

Place, publisher, year, edition, pages
Uppsala: Acta Universitatis Upsaliensis, 2016. 93 p.
Series
Digital Comprehensive Summaries of Uppsala Dissertations from the Faculty of Science and Technology, ISSN 1651-6214 ; 1357
Keyword
Liquid, Elastomer, Cross-linking, Liquid alloy, PDMS, Adaptability, Compliance, Interface, Patterning, Printing, Surface energy, Wetting, Composite, Modulus, Stretchability, Viscoelasticity, Thermal conductivity, Contact resistance, Adhesion, Packaging, Integration, Microsystems, Microfluidics, Strain sensor, Thermoelectrics, Inductive coupling, Wireless communication, Stretchable electron-ics, Epidermal electronics, Skin electronics, Soft robotics, Wearable electronics
National Category
Composite Science and Engineering Textile, Rubber and Polymeric Materials Energy Engineering Other Engineering and Technologies not elsewhere specified Embedded Systems Robotics
Research subject
Engineering Science with specialization in Microsystems Technology; Engineering Science with specialization in Materials Science
Identifiers
urn:nbn:se:uu:diva-281281 (URN)978-91-554-9521-3 (ISBN)
Public defence
2016-05-11, Polhemsalen, Ångströmlaboratoriet, Lägerhyddsvägen 1, Uppsala, 09:15 (English)
Opponent
Supervisors
Available from: 2016-04-19 Created: 2016-03-21 Last updated: 2016-04-21

Open Access in DiVA

No full text

Other links

Publisher's full text

Authority records BETA

Jeong, Seung HeeHjort, KlasJobs, MagnusSundqvist, JohanWu, Zhigang

Search in DiVA

By author/editor
Jeong, Seung HeeHjort, KlasJobs, MagnusSundqvist, JohanWu, Zhigang
By organisation
Microsystems TechnologySolid State Electronics
In the same journal
Lab on a Chip
Electrical Engineering, Electronic Engineering, Information EngineeringOther Materials Engineering

Search outside of DiVA

GoogleGoogle Scholar

doi
urn-nbn

Altmetric score

doi
urn-nbn
Total: 1101 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf