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A SILICON CONDENSER MICROPHONE USING BOND AND ETCH-BACK TECHNOLOGY
Uppsala University.
Uppsala University.
1994 (English)In: SENSORS AND ACTUATORS A-PHYSICAL, ISSN 0924-4247, Vol. 45, no 2, 115-124 p.Article in journal (Other scientific) Published
Abstract [en]

A new technology for the fabrication of condenser microphones in silicon has been developed. Bond and etch-back techniques and surface micromachining of monocrystalline silicon allow for a highly simplified process. The fabrication process has been applie

Place, publisher, year, edition, pages
ELSEVIER SCIENCE SA LAUSANNE , 1994. Vol. 45, no 2, 115-124 p.
Keyword [en]
BONDING TECHNIQUE; CONDENSER MICROPHONES; ETCH-BACK TECHNIQUE; SILICON; NITRIDE MEMBRANE; ON-INSULATOR; PLATE
Identifiers
URN: urn:nbn:se:uu:diva-28478OAI: oai:DiVA.org:uu-28478DiVA: diva2:56374
Note
Addresses: BERGQVIST J, CTR SUISSE ELECTRON & MICROTECHN SA, SENSOR & ACTUATOR MICROSYST SECT, CH-2007 NEUCHATEL, SWITZERLAND. UNIV UPPSALA, DEPT ELECTR, S-75105 UPPSALA, SWEDEN.Available from: 2008-10-17 Created: 2008-10-17 Last updated: 2011-01-16

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