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Mechanical characterization of thick polysilicon films: Young's modulus and fracture strength evaluated with microstructures
Uppsala University.
Uppsala University.
Uppsala University.
Uppsala University.
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1999 (English)In: JOURNAL OF MICROMECHANICS AND MICROENGINEERING, ISSN 0960-1317, Vol. 9, no 3, 245-251 p.Article in journal (Other scientific) Published
Abstract [en]

Young's modulus and the fracture strength of thick polysilicon films were evaluated with surface micromachined test structures. The polysilicon films were deposited in an epitaxial reactor and were about 10.5 mu m thick. Four different processing schemes

Place, publisher, year, edition, pages
IOP PUBLISHING LTD , 1999. Vol. 9, no 3, 245-251 p.
Keyword [en]
TENSILE-STRENGTH; STRESS
Identifiers
URN: urn:nbn:se:uu:diva-28698OAI: oai:DiVA.org:uu-28698DiVA: diva2:56594
Note
Addresses: Greek S, Univ Uppsala, Dept Mat Sci, Box 534, S-75121 Uppsala, Sweden. Univ Uppsala, Dept Mat Sci, S-75121 Uppsala, Sweden. R Bosch Gmbh, Automot Equipment Div, D-72703 Reutlingen, Germany.Available from: 2008-10-17 Created: 2008-10-17 Last updated: 2011-01-14

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