Mechanical characterization of thick polysilicon films: Young's modulus and fracture strength evaluated with microstructures
1999 (English)In: JOURNAL OF MICROMECHANICS AND MICROENGINEERING, ISSN 0960-1317, Vol. 9, no 3, 245-251 p.Article in journal (Other scientific) Published
Young's modulus and the fracture strength of thick polysilicon films were evaluated with surface micromachined test structures. The polysilicon films were deposited in an epitaxial reactor and were about 10.5 mu m thick. Four different processing schemes
Place, publisher, year, edition, pages
IOP PUBLISHING LTD , 1999. Vol. 9, no 3, 245-251 p.
IdentifiersURN: urn:nbn:se:uu:diva-28698OAI: oai:DiVA.org:uu-28698DiVA: diva2:56594
Addresses: Greek S, Univ Uppsala, Dept Mat Sci, Box 534, S-75121 Uppsala, Sweden. Univ Uppsala, Dept Mat Sci, S-75121 Uppsala, Sweden. R Bosch Gmbh, Automot Equipment Div, D-72703 Reutlingen, Germany.2008-10-172008-10-172011-01-14