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Weibull fracture probability for silicon wafer bond evaluation
Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Materials Science. Physics, Department of Physics and Materials Science, Materials Science. Department of Engineering Sciences, Electronics. Fasta tillståndets elektronik / ÅSTC.
Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Materials Science. Physics, Department of Physics and Materials Science, Materials Science. Department of Engineering Sciences, Electronics. Fasta tillståndets elektronik / ÅSTC.
Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Materials Science. Physics, Department of Physics and Materials Science, Materials Science. Department of Engineering Sciences, Electronics. Materialvetenskap.
Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Materials Science. Physics, Department of Physics and Materials Science, Materials Science. Department of Engineering Sciences, Electronics. ÅSTC.
2000 (English)In: JOURNAL OF THE ELECTROCHEMICAL SOCIETY, ISSN 0013-4651, Vol. 147, no 12, p. 4683-4687Article in journal (Refereed) Published
Abstract [en]

This work presents a strategy toward determining the mechanical reliability of bonded silicon microsystems. The fracture strength of a bond has been examined using burst tests and Weibull statistics. The testing method in itself exhibits small errors, is

Place, publisher, year, edition, pages
2000. Vol. 147, no 12, p. 4683-4687
Keyword [en]
STRENGTH
Identifiers
URN: urn:nbn:se:uu:diva-37430OAI: oai:DiVA.org:uu-37430DiVA, id: diva2:65329
Note
Addresses: Kohler J, Uppsala Univ, Dept Solid State Elect, SE-75121 Uppsala, Sweden. Uppsala Univ, Dept Solid State Elect, SE-75121 Uppsala, Sweden. Uppsala Univ, Angstrom Lab, Dept Mat Sci, SE-75121 Uppsala, Sweden. Spectrogon AB, SE-18302 Taby, Sweden.Available from: 2007-02-28 Created: 2007-02-28 Last updated: 2011-01-14

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Köhler, JohanStenmark, Lars

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