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Weibull fracture probability for silicon wafer bond evaluation
Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Materials Science. Physics, Department of Physics and Materials Science, Materials Science. Department of Engineering Sciences, Electronics. Fasta tillståndets elektronik / ÅSTC.
Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Materials Science. Physics, Department of Physics and Materials Science, Materials Science. Department of Engineering Sciences, Electronics. Fasta tillståndets elektronik / ÅSTC.
Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Materials Science. Physics, Department of Physics and Materials Science, Materials Science. Department of Engineering Sciences, Electronics. Materialvetenskap.
Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Materials Science. Physics, Department of Physics and Materials Science, Materials Science. Department of Engineering Sciences, Electronics. ÅSTC.
2000 (English)In: JOURNAL OF THE ELECTROCHEMICAL SOCIETY, ISSN 0013-4651, Vol. 147, no 12, 4683-4687 p.Article in journal (Refereed) Published
Abstract [en]

This work presents a strategy toward determining the mechanical reliability of bonded silicon microsystems. The fracture strength of a bond has been examined using burst tests and Weibull statistics. The testing method in itself exhibits small errors, is

Place, publisher, year, edition, pages
2000. Vol. 147, no 12, 4683-4687 p.
Keyword [en]
STRENGTH
Identifiers
URN: urn:nbn:se:uu:diva-37430OAI: oai:DiVA.org:uu-37430DiVA: diva2:65329
Note
Addresses: Kohler J, Uppsala Univ, Dept Solid State Elect, SE-75121 Uppsala, Sweden. Uppsala Univ, Dept Solid State Elect, SE-75121 Uppsala, Sweden. Uppsala Univ, Angstrom Lab, Dept Mat Sci, SE-75121 Uppsala, Sweden. Spectrogon AB, SE-18302 Taby, Sweden.Available from: 2007-02-28 Created: 2007-02-28 Last updated: 2011-01-14

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Köhler, JohanStenmark, Lars

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