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Formation of heat sinks using bonding and etch back technique in combination with diamond deposition
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Solid State Electronics.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Solid State Electronics.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Solid State Electronics.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Solid State Electronics.
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1993 (English)In: Proceedings of 2nd Int. Symp. on Semiconductor Wafer Bonding, 1993, 382- p.Conference paper, Oral presentation with published abstract (Refereed)
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1993. 382- p.
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Other Electrical Engineering, Electronic Engineering, Information Engineering
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URN: urn:nbn:se:uu:diva-210690OAI: oai:DiVA.org:uu-210690DiVA: diva2:664079
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2nd Int. Symp. on Semiconductor Wafer Bonding
Available from: 2013-11-13 Created: 2013-11-13 Last updated: 2013-11-13

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Olsson, Jörgen

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