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Oxygen plasma wafer bonding evaluated by the weibull fracture probability method
Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Materials Science. Physics, Department of Physics and Materials Science, Materials Science. Department of Engineering Sciences, Electronics. Fasta tillståndets elektronik / ÅSTC.
Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Materials Science. Physics, Department of Physics and Materials Science, Materials Science. Department of Engineering Sciences, Electronics. Fasta tillståndets elektronik / ÅSTC.
Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Materials Science. Physics, Department of Physics and Materials Science, Materials Science. Department of Engineering Sciences, Electronics. Fasta tillståndets elektronik.
Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Materials Science. Physics, Department of Physics and Materials Science, Materials Science. Department of Engineering Sciences, Electronics. ÅSTC.
2000 (English)In: Proc of the Eleventh Micromechanics Europe Workshop, Oct, Uppsala, Sweden, 2000Conference paper, Published paper (Refereed)
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2000.
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Other Electrical Engineering, Electronic Engineering, Information Engineering
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URN: urn:nbn:se:uu:diva-39627OAI: oai:DiVA.org:uu-39627DiVA: diva2:67526
Available from: 2007-02-28 Created: 2007-02-28

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Köhler, JohanStenmark, Lars

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