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Chip mounting and interconnection in multi chip modules for space applications
Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Materials Science. Department of Engineering Sciences, Electronics. Physics, Department of Physics and Materials Science, Materials Science. ÅSTC.
Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Materials Science. Department of Engineering Sciences, Electronics. Physics, Department of Physics and Materials Science, Materials Science. Fasta tillståndets elektronik.
Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Materials Science. Department of Engineering Sciences, Electronics. Physics, Department of Physics and Materials Science, Materials Science. ÅSTC.
2000 (English)In: Proc MME`00 Oct, Uppsala, Sweden, 2000Conference paper, Published paper (Refereed)
Place, publisher, year, edition, pages
2000.
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Other Electrical Engineering, Electronic Engineering, Information Engineering
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URN: urn:nbn:se:uu:diva-39634OAI: oai:DiVA.org:uu-39634DiVA: diva2:67533
Available from: 2007-02-28 Created: 2007-02-28

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Stenmark, Lars

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