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Possible application of direct bonding for integration of MW elements to silicon circuits
Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Materials Science. MATERIALS SCIENCE/MST.
2000 (English)In: MEMSWAVE-II, Budapest, Hungary, , 17 p.Conference proceedings (editor) (Other scientific)
Place, publisher, year, edition, pages
2000. , 17 p.
URN: urn:nbn:se:uu:diva-39708OAI: oai:DiVA.org:uu-39708DiVA: diva2:67608
Available from: 2008-10-17 Created: 2008-10-17

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