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Silicon surfaces for hydrophobic wafer bonding
Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Materials Science. Department of Engineering Sciences, Electronics. Fasta tillståndets elektronik.
Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Materials Science. Department of Engineering Sciences, Electronics. Fasta tillståndets elektronik.
Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Materials Science. Department of Engineering Sciences, Electronics. Fasta tillståndets elektronik.
1997 (English)In: Proc of the Fourth International Symosium on Semiconductor Wafer Bonding: Science, Technology and Applications, Electrochemical Society Proceedings Vol 97-36,, 1997, 87-94 p.Conference paper, Published paper (Refereed)
Place, publisher, year, edition, pages
1997. 87-94 p.
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Other Electrical Engineering, Electronic Engineering, Information Engineering
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URN: urn:nbn:se:uu:diva-40437OAI: oai:DiVA.org:uu-40437DiVA: diva2:68338
Available from: 2007-03-05 Created: 2007-03-05

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