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Modification of Silicon Surfaces with H2SO4:H2O2:HF and HNO3:HF for Wafer Bonding Applications
Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Materials Science. SOLID STATE ELECTRONICS.
1994 (English)In: The 187th ECS Meeting 1994, 1994Conference paper, Published paper (Refereed)
Place, publisher, year, edition, pages
1994.
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Other Electrical Engineering, Electronic Engineering, Information Engineering
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URN: urn:nbn:se:uu:diva-40463OAI: oai:DiVA.org:uu-40463DiVA: diva2:68364
Available from: 2008-10-17 Created: 2008-10-17

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