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The effects of HF-cleaning prior to silicon wafer bonding
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Materials Science. Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Electronics.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Materials Science. Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Electronics.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Materials Science. Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Electronics.
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1995 (English)In: Journal of the Electrochemical Society, ISSN 0013-4651, E-ISSN 1945-7111, Vol. 142, no 4, 1297-1303 p.Article in journal (Refereed) Published
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1995. Vol. 142, no 4, 1297-1303 p.
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Other Electrical Engineering, Electronic Engineering, Information Engineering
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URN: urn:nbn:se:uu:diva-40481DOI: 10.1149/1.2044167OAI: oai:DiVA.org:uu-40481DiVA: diva2:68382
Available from: 2007-03-07 Created: 2007-03-07 Last updated: 2017-12-06Bibliographically approved

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Bäcklund, Ylva

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