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Damages in oxygen plasma bonding
Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Materials Science. Physics, Department of Physics and Materials Science, Materials Science. Department of Engineering Sciences, Electronics. Materialvetenskap.
Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Materials Science. Physics, Department of Physics and Materials Science, Materials Science. Department of Engineering Sciences, Electronics. Fasta tillståndets elektronik.
Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Materials Science. Physics, Department of Physics and Materials Science, Materials Science. Department of Engineering Sciences, Electronics. Materialvetenskap.
1999 (English)In: The 5th Int Symp Semicind Wafer Bond, 196th Electrochem Soc Meeting, Honolulu, Hawaii Abstract no 1001, 1999Conference paper, Published paper (Refereed)
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1999.
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Other Electrical Engineering, Electronic Engineering, Information Engineering
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URN: urn:nbn:se:uu:diva-41759OAI: oai:DiVA.org:uu-41759DiVA: diva2:69660
Available from: 2007-02-28 Created: 2007-02-28

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