uu.seUppsala University Publications
Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
Interconnect Material Choices for Future Scaled Devices
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Solid State Electronics.
Show others and affiliations
2012 (English)Conference paper, Published paper (Refereed)
Place, publisher, year, edition, pages
2012.
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:uu:diva-222467OAI: oai:DiVA.org:uu-222467DiVA: diva2:711669
Conference
Advanced Metallization Conference
Available from: 2014-04-10 Created: 2014-04-10 Last updated: 2014-04-10

Open Access in DiVA

No full text

Authority records BETA

Zhen, Zhang

Search in DiVA

By author/editor
Zhen, Zhang
By organisation
Solid State Electronics
Engineering and Technology

Search outside of DiVA

GoogleGoogle Scholar

urn-nbn

Altmetric score

urn-nbn
Total: 789 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf