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Transfer of InP-based epilayers by wafer bonding (invited)
Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Technology, Department of Engineering Sciences. Uppsala University, Teknisk-naturvetenskapliga vetenskapsområdet, Physics, Department of Physics and Materials Science, Materials Science. Materialvetenskap.
2003 (English)In: ICMAT 2003, 2nd Int. Conf. on Materials for Adv. Technol. & IUMRS, 2003, 354- p.Conference paper (Other scientific)
Place, publisher, year, edition, pages
2003. 354- p.
URN: urn:nbn:se:uu:diva-47228OAI: oai:DiVA.org:uu-47228DiVA: diva2:75135
Available from: 2007-01-16 Created: 2007-01-16

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