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Weibull fracture probability for silicon wafer bond evaluation
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Materials Science. ÅSTC. Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Electronics. Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Materials Science.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Materials Science. ÅSTC. Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Electronics. Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Materials Science.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Materials Science. Materialvetenskap. Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Electronics. Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Materials Science.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Materials Science. ÅSTC. Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Electronics. Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Materials Science.
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1999 (English)In: 5th International Symposium Semicond. Wafer Bonding, Honolulu, 1999Conference paper, Published paper (Refereed)
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1999.
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URN: urn:nbn:se:uu:diva-47979OAI: oai:DiVA.org:uu-47979DiVA: diva2:75886
Available from: 2007-02-09 Created: 2007-02-09 Last updated: 2012-06-20

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Bäcklund, Ylva

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