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Thermomechanical behaviour and pressure sensing of ceramic wireless devices for high-temperature environments
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology, Ångström Space Technology Centre (ÅSTC). Swedish National Defence College.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology.ORCID iD: 0000-0002-5452-7831
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology.
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Microsystems Technology.
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2014 (English)Conference paper, Oral presentation with published abstract (Refereed)
Abstract [en]

This paper reports on the design, fabrication and thermomechanical characterization of wirelessceramic devices, one with an integrated pressure sensor element. The project aims at developingmicrosystems for sensing in harsh environments where conventional electronic devices are restrained.Here, the devices are LC resonating circuits made from High-Temperature Co-fired Ceramic (HTCC)aluminium oxide green tapes. For the fabrication, the tapes were screen-printed with platinum paste,micromachined, stacked, laminated and fired. The additional sensor element was made from the samematerial and with the same processes, and contains a cavity sealed with a capacitive membrane.Thermomechanical characterization was made by investigating the bimorphic behaviour due to CTEmismatch as well as the resonance frequency of the devices as a function of mechanical displacement.Also, the resonance frequency as a function of pressure was demonstrated for the device with anintegrated pressure sensor node. The wireless readings were performed with a tuneable resonating loopantenna. The devices showed a relatively low quality factor value. The bimorphic behaviour is lowwith only small variations for temperatures up to 400°C. As for the mechanical displacement, theresonance frequency was only affected for thin devices at forced deformations that were larger thanthose observed as a function of temperature. For the device with an integrated pressure sensor, a clearpressure-induced frequency shift of 6785 ppm was observed at 1.5 bar. This indicates that the devicesare robust for high temperatures and also applicable for pressure readings. Future work will furtherexpand on high-temperature characterization of the devices.

Place, publisher, year, edition, pages
2014. 75-80 p.
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:uu:diva-239426OAI: oai:DiVA.org:uu-239426DiVA: diva2:774497
Conference
The 10th Micronano System Workshop (MSW 2014), 2014, Uppsala, Sweden
Available from: 2014-12-23 Created: 2014-12-23 Last updated: 2015-01-08

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Khaji, ZahraKlintberg, LenaThornell, Greger

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