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Influence of bonded area ratio on the strength of FAB seals between silicon microstructures and glass
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Solid State Electronics.
1988 (English)In: Sensors and materials, ISSN 0914-4935, Vol. 4, 209-221 p.Article in journal (Refereed) Published
Place, publisher, year, edition, pages
1988. Vol. 4, 209-221 p.
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Engineering and Technology
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URN: urn:nbn:se:uu:diva-258411OAI: oai:DiVA.org:uu-258411DiVA: diva2:841622
Available from: 2015-07-14 Created: 2015-07-14 Last updated: 2017-12-04

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CiteExportLink to record
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