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Patterning of silicon wafers using the plasma jet dry etching technique
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Solid State Electronics.
1989 (English)Conference paper, Published paper (Refereed)
Place, publisher, year, edition, pages
1989.
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:uu:diva-258417OAI: oai:DiVA.org:uu-258417DiVA: diva2:841632
Conference
11th International Vacuum Congress, 7th International Conference on Solid Surfaces, Köln, Tyskland
Available from: 2015-07-14 Created: 2015-07-14 Last updated: 2015-07-14

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CiteExportLink to record
Permanent link

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Cite
Citation style
  • apa
  • ieee
  • modern-language-association
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
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