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Modification of silicon surfaces with H2SO4:H2O2:HF and HNO3:HF for wafer bonding applications
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Solid State Electronics.
1994 (English)Conference paper (Refereed)
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Engineering and Technology
URN: urn:nbn:se:uu:diva-258613OAI: oai:DiVA.org:uu-258613DiVA: diva2:842047
187th ECS Meeting
Available from: 2015-07-16 Created: 2015-07-16 Last updated: 2015-07-16

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