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Patterning of silicon wafers using the plasma jet dry etching technique
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Solid State Electronics.
1990 (English)In: Vacuum, ISSN 0042-207X, E-ISSN 1879-2715, Vol. 41, no 4Article in journal (Refereed) Published
Place, publisher, year, edition, pages
1990. Vol. 41, no 4
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Engineering and Technology
URN: urn:nbn:se:uu:diva-258638OAI: oai:DiVA.org:uu-258638DiVA: diva2:842166
Available from: 2015-07-17 Created: 2015-07-17 Last updated: 2015-07-17

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