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A novel etch stop method aimed for fabrication of BESOI material and thin silicon membranes
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Solid State Electronics.
1991 (English)Conference paper, Published paper (Refereed)
Place, publisher, year, edition, pages
1991. 211-220 p.
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:uu:diva-258665OAI: oai:DiVA.org:uu-258665DiVA: diva2:842217
Conference
1st Int symp on semiconductor wafer bonding science, Phoenix, Arizona, USA
Available from: 2015-07-17 Created: 2015-07-17 Last updated: 2015-07-17

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CiteExportLink to record
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Citation style
  • apa
  • ieee
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Language
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  • en-US
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  • nn-NO
  • nn-NB
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Output format
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