uu.seUppsala University Publications
Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
Assembling three-dimensional microstructures using gold-silicon eutectic bonding
Uppsala University, Disciplinary Domain of Science and Technology, Technology, Department of Engineering Sciences, Solid State Electronics.
Show others and affiliations
1994 (English)In: Sensors and Actuators A-Physical, ISSN 0924-4247, E-ISSN 1873-3069, Vol. 45, 227-236 p.Article in journal (Refereed) Published
Place, publisher, year, edition, pages
1994. Vol. 45, 227-236 p.
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:uu:diva-258706OAI: oai:DiVA.org:uu-258706DiVA: diva2:842282
Available from: 2015-07-17 Created: 2015-07-17 Last updated: 2017-12-04

Open Access in DiVA

No full text

By organisation
Solid State Electronics
In the same journal
Sensors and Actuators A-Physical
Engineering and Technology

Search outside of DiVA

GoogleGoogle Scholar

urn-nbn

Altmetric score

urn-nbn
Total: 721 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf