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Design and experimental evaluation of compensated bondwire interconnects above 100 GHz
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2015 (English)In: International journal of microwave and wireless technologies, ISSN 1759-0795, E-ISSN 1759-0787, Vol. 7, no 3-4, 261-270 p.Article in journal (Refereed) Published
Abstract [en]

Different types of bondwire interconnect for differential chip-to-antenna and single-ended chip-to-chip interfaces are investigated. Two differential compensation structures for various lengths of interconnects are designed and experimentally evaluated using dedicated transmit and receive radar modules operating across a 110-156 GHz band. Measurement results demonstrate that a fractional bandwidth of 7.5% and a minimum insertion loss of 0.2 dB can be achieved for differential interconnects as long as 0.8 mm. Design and measurement results of an extremely wideband low-loss single-ended chip-to-chip bondwire interconnect that features 1.5 dB bandwidth from DC to 170 GHz and insertion loss of less than 1 dB at 140 GHz are presented as well. The results show that the well-established wire-bonding techniques are still an attractive solution even beyond 100 GHz. Reproducibility and scalability of the proposed solutions are assessed as well.

Place, publisher, year, edition, pages
2015. Vol. 7, no 3-4, 261-270 p.
Keyword [en]
Hybrid and multi-chip modules, Circuit design and applications
National Category
Telecommunications
Identifiers
URN: urn:nbn:se:uu:diva-260871DOI: 10.1017/S1759078715000070ISI: 000358325700007OAI: oai:DiVA.org:uu-260871DiVA: diva2:848644
Note

Funding: EU project NANOTEC under the grant agreement No 288531

Available from: 2015-08-25 Created: 2015-08-25 Last updated: 2017-12-04Bibliographically approved

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Dancila, DragosRydberg, Anders

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