Analysis of the micromechanical deformation in pressboard performed by X-ray microtomography
2015 (English)In: 2015 IEEE Electrical Insulation Conference (EIC), 2015, 89-92 p.Conference paper (Refereed)
A large number of electrical insulation components are produced in paper-based materials. Paper combines good insulating properties with the necessary mechanical and chemical stability. Paper consists of a system of fibers binding to each other creating a strong network. The presence of large open pores allows for impregnability of the material but also causes mechanical weakness in particular in the out-of-plane direction of the material. This aspect is important for pressboard components, where the resistance to compression stress is relevant for e.g. transformer windings. It is therefore relevant to understand the mechanisms that underlay the out-of-plane deformation of pressboard. In order to get a clear picture of the deformation patterns within the material, X-ray micro-computed tomography was used. Pressboard test pieces were subjected to in-situ out-of-plane compressive loading. 3D images of the sample could be captured before, during and after the loading sequence. Image analysis allowed for the definition of strain fields. The results revealed a strong correlation between the density variation within the sample and the strain calculated from the 3D images.
Place, publisher, year, edition, pages
2015. 89-92 p.
IdentifiersURN: urn:nbn:se:uu:diva-268539DOI: 10.1109/ICACACT.2014.7223479ISI: 000371481800018ISBN: 978-1-4799-7354-5OAI: oai:DiVA.org:uu-268539DiVA: diva2:877542
33rd IEEE Electrical Insulation Conference (EIC), JUN 07-10, 2015, Seattle, WA, USA